A module for optically and structurally coupling a light diffusion optical fiber to a laser diode on a substrate in a compact module includes a fiber holder into which an exposed core of the laser extends and which is placed about the laser on a substrate such that the laser and fiber are axially aligned in butt coupled relation. A resilient strain relief housing is secured about the light receiving end of the fiber, and the fiber holder and substrate are inserted into the housing in a secured in a water sealing engagement.

A receiver optical sub-assembly, a combo bi-directional optical sub-assembly, a combo optical module, an optical line terminal, and a passive optical network system, where the receiver optical sub-assembly includes a first transistor-outline can, where a light incident hole is disposed on the first transistor-outline can, and where a first demultiplexer, a first optical receiver, a second optical receiver, and an optical lens combination are packaged in the first transistor-outline can.

This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

A process of making a coupling device for physically and optically coupling an optical fiber to route optical signals to/from optical receiver/transmitter. The coupling device includes a structured reflective surface that functions as an optical element that directs light to/from the input/output ends of the optical fiber by reflection, and an optical fiber retention groove structure that positively receives the optical fiber in a manner with the end of the optical fiber at a defined distance to and aligned with the structured reflective surface. The open structure of the structured reflective surface and fiber retention structure lends itself to mass production processes such as precision stamping. The coupling device can be attached to an optical transmitter and/or receiver, with the structured reflective surface aligned to the light source in the transmitter or to the detector in the receiver, and adapted in an active optical cable.

A hermetic optical fiber alignment assembly includes a ferrule portion having a plurality of grooves receiving the end sections of optical fibers, wherein the grooves define the location and orientation of the end sections with respect to the ferrule portion. The assembly includes an integrated optical element for coupling the input/output of an optical fiber to the opto-electronic devices in the opto-electronic module. The optical element can be in the form of a structured reflective surface. The end of the optical fiber is at a defined distance to and aligned with the structured reflective surface. The structured reflective surfaces and the fiber alignment grooves can be formed by stamping.

A multi-wavelength integrated device (5) including plural semiconductor lasers (6) and plural modulators (7) modulating output beams of the plural semiconductor lasers (6) respectively is mounted on the stem (1). Plural leads (10) penetrates through the stem (1) and are connected to the plural semiconductor lasers (6) and the plural modulators (7) respectively. Each lead (10) is a coaxial line in which plural layers are concentrically overlapped with one another. The coaxial line includes a high frequency signal line (12) transmitting a high frequency signal to the modulator (7), a GNU line (14), and a feed line (16) feeding a DC current to the semiconductor laser (6). The high frequency signal line (12) is arranged at a center of the coaxial line. The GND line (14) and the feed line (16) are arranged outside the high frequency signal line (12).

A bidirectional optical subassembly, an optical transceiver including the same, and methods of making and using the same are disclosed. The optical subassembly includes a photodiode configured to receive an incoming optical signal, a transmitter configured to transmit an outgoing optical signal, and a passive optical signal processing unit including a filter and a mirror. The filter is at a first predetermined angle relative to an optical path of the outgoing optical signal and is configured to (i) reflect one of the outgoing optical signal and the incoming optical signal and (ii) allow the other of the outgoing optical signal and the incoming optical signal to pass through. The mirror is configured to reflect the one of the outgoing optical signal and the incoming optical signal at a second predetermined angle. The first predetermined angle is adapted to reduce filter insertion losses.

The invention relates to the field of optical communication network modules, and provides a 4-channel CWDM QSFP optical module, comprising a QSFP base and four optical transmitting sub-devices. The four optical transmitting sub-devices are mounted on the base in parallel, and there is a gap between each of the optical transmitting sub-devices and the base. The QSFP optical module further includes CWDM optical components for multiplexing 4-channel optical signals emitted by the four optical transmitting sub-devices. The CWDM optical components comprise a single fiber pigtail for transmitting the multiplexed optical signal, the single fiber pigtail being at least partially located in the gap. The 4-channel CWDM QSFP optical module of the invention connects the four optical transmitting sub-devices with the CWDM optical components by a reasonable method of optical fiber winding, thereby solves the problem that it is difficult to achieve single-mode fiber coupling of four LDs in a small space.

The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.