This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure.

Provided are an optical module and a transmission equipment in which a decrease in yield due to brazing or soldering is suppressed. Provided is an optical module including a semiconductor optical element, a stem, and a wiring substrate. The stem includes one or more lead terminals. The wiring substrate includes one or more openings through which the one or more lead terminals, respectively, pass. The stem has a placing surface on which the wiring substrate is placed, and two protrusion portions that are arranged on both external sides, respectively, of the wiring substrate. The wiring substrate further includes a ground conductor layer being positioned on a rear surface and two ground conductor patterns that are arranged on regions, respectively, that are in the vicinity of the two protrusion portions, of a front surface, and are electrically connected to the ground conductor layer.

Embodiments include transistor-outline packages, methods, optical sub-assemblies, and optical modules associated therewith. In some embodiments a transistor-outline package includes a transistor base, a transistor cap, a first lens, a light filtering assembly, a lens assembly, a first optical receiving chip, and a second optical receiving chip. The transistor base and the transistor cap are fastened to form an accommodation cavity. The first lens is disposed on the transistor cap, and the first optical receiving chip and second optical receiving chip are disposed on the transistor base. The lens assembly includes a second lens and a third lens. The light filtering assembly is disposed between the first lens and the lens assembly. The transistor-outline package receives and collimates a first light ray by using the first lens on the transistor cap, and the light filtering assembly splits the first light ray into a second light ray and a third light ray.

A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.

One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

A module for optically and structurally coupling a light diffusion optical fiber to a laser or LED diode on a substrate in a compact module includes a fiber holder into which an exposed core of the laser or LED extends and which is placed about the laser or LED on a substrate such that the laser and fiber are axially aligned in butt coupled relation. A resilient strain relief housing is secured about the light receiving end of the fiber, and the fiber holder and substrate are inserted into the housing in a secured in a water sealing engagement.

An optical module includes a housing, a plurality of active optical components and a path changer component. The housing has an airtight chamber. The active optical components are provided in the airtight chamber. The path changer component is provided in the airtight chamber, and the path changer component is configured to change an optical path of at least one of the active optical components.

A coaxial transmitter optical subassembly (TOSA) including a cuboid type TO laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The cuboid type TO laser package is made of a thermally conductive material and has substantially flat outer surfaces that may be thermally coupled to substantially flat outer surfaces on a transceiver housing and/or on other cuboid type TO laser packages. An optical transceiver may include multiple coaxial TOSAs with the cuboid type TO laser packages stacked in the transceiver housing. The cuboid type TO laser package may thus provide improved thermal characteristics and a reduced size within the optical transceiver.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.