An optical module includes: a butterfly-type optical device including a body that contains a heating element in an interior space, a lid body that puts a lid on the interior space, and a plurality of pins; a substrate including a connecting surface to which the plurality of pins are connected; and a heat-dissipating component arranged to the connecting surface side, wherein the optical device is connected to the connecting surface with a heat-dissipating surface, of a part that has been arranged with the heating element, oriented to the heat-dissipating component side, and with a gap provided to a side of the lid body opposite to a side of the interior space.

A package for housing a semiconductor element includes a base body including a bottom plate section and a frame-shaped side wall section; and an input/output terminal provided so as to pass through the side wall section, the input/output terminal having a plate section on which line conductors are formed, and a vertical wall section which is fixed to the plate section so as to continue to the side wall section and so that the line conductors are sandwiched between the plate section and the vertical wall section and both ends of the line conductors are exposed from the vertical wall section. The vertical wall section has a thick section in a center portion of a side surface of the vertical wall section in a direction along the side wall section, the thick section having thick wall thickness, a lower end of the thick section being fixed to the plate section.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

An optical apparatus includes: a housing; at least one component housed in the housing, the at least one component being configured to be energized and perform at least one of outputting light, receiving light, and changing a property of light; a plurality of external connection conductors configured to penetrate through the housing; and a flexible substrate housed in the housing, the flexible substrate including an insulation layer, a plurality of conductive wires each configured to perform at least one of conduction between the component and the external connection conductors, conduction between the external connection conductors, and conduction between a plurality of the components each serving as the at least one component, a base part in which the conductive wires are covered by the insulation layer, and a plurality of arm parts protruding and extending from the base part, each including one of the conductive wires.