An optical module includes: a casing in which light is propagated; a heating portion; a device arranged inside the casing and configured to change, when heated, characteristics of the light propagated inside the casing; and a first member thermally connected to the heating portion and the device, the first member including a hollow arranged in a heat transfer path from the heating portion to the device and configured to prevent convective heat transmission to an inside of the casing.

A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.

A laser system and method generate milliwatt-power pump light by a fiber-coupled laser diode with a single-mode integrated fiber housed in a pump enclosure. The milliwatt-power pump light is conveyed from the single-mode integrated fiber out of the first enclosure into one end of a single-mode fiber cable that is external to the pump enclosure. The milliwatt-power pump light is conveyed from an opposite end of the external single-mode fiber cable into one end of a single-mode resident fiber disposed internally within a laser-head enclosure. A crystal housed in the laser-head enclosure is pumped with the milliwatt-power pump light that exits into free space from an opposite end of the single-mode resident fiber onto a face of the crystal, to produce stable milliwatt-power single-mode laser light having a frequency stability of less than 3 MHz per minute. The stable milliwatt-power single-mode laser light is emitted from the laser-head enclosure.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

A heat dissipation assembly and a communication module. The heat dissipation assembly includes a housing and a heat generation device disposed inside the housing, wherein the housing is provided therein with a heat insulation cavity around the periphery of the heat generation device, the heat insulation cavity is provided with a through hole, and the housing is provided therein with a heat conduction assembly disposed through the through hole and configured to conduct the heat of the heat generation device to the housing.

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

An optical receiving assembly, a method for controlling the same, and an optical module are provided. The optical receiving assembly includes an optical receiving port, an adjustable optical path deflection assembly, a semiconductor optical amplifier, an optical detector, and a controller. An optical signal received by the optical receiving port is incident onto the semiconductor optical amplifier after a deflection angle of the optical signal is adjusted. The semiconductor optical amplifier amplifies and couples the incident optical signal to the optical detector, which converts the received optical signal into an electrical signal for output. The controller controls the adjustable optical path deflection assembly to adjust the deflection angle according to the changes of the electrical signal strength, so as to adjust a coupling efficiency of the optical signal coupled to the semiconductor optical amplifier and maintain the electrical signal output by the optical detector within a preset range.

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.