An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.

A silicon photonics optical transceiver device includes a silicon photonics optical module and a heat conducting housing that accommodates the silicon photonic optical module therein. The heat conducting housing has an inner surface formed with a first heat dissipation portion that wraps around and is in contact with transmitter optical sub-assemblies of the silicon photonics optical module to realize thermal conduction, and a second heat dissipation portion that is in contact with a digital signal processor of the silicon photonics optical module to realize thermal conduction.

Provided herein is an optoelectronic device having a printed circuit board (PCB) with a planar PCB surface; a photonic integrated circuit (PIC) with a fiber attach region for attachment to a fiber array (FA) and an electronic interface for connecting to the PCB. The PIC is mounted on a portion of the PCB surface being an integral part of the PCB surface. The PCB has an opening preferably circumferentially surrounded by portions of the PCB and dividing the PCB surface in a first and second region for thermally insulating the first region and the second region from one another. The portion of the PCB surface on which the PIC is mounted belongs to the first region, and the connecting of the electronic interface to the PCB relates to at least one wire bond extending to the second region, preferably in the optoelectronic device.

An optical engine includes a substrate provided with terminals configured to connect to a connector provided on another substrate, a light receiver/emitter mounted on the substrate, and a cover covering the substrate. The light receiver/emitter is any one of a light receiver, a light emitter, and an element having functions of both the light receiver and the light emitter.

A pixel circuit having a function of compensating for characteristic variation of an electro-optical element and threshold voltage variation of a transistor is formed from a reduced number of component elements. An input signal is sampled from a signal line so as to be held in a holding capacitor. The threshold voltage of the drive transistor is imparted to the holding capacitor in order to cancel an influence of the threshold voltage.

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.

A coaxial transmitter optical subassembly (TOSA) including a cuboid type TO laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The cuboid type TO laser package is made of a thermally conductive material and has substantially flat outer surfaces that may be thermally coupled to substantially flat outer surfaces on a transceiver housing and/or on other cuboid type TO laser packages. An optical transceiver may include multiple coaxial TOSAs with the cuboid type TO laser packages stacked in the transceiver housing. The cuboid type TO laser package may thus provide improved thermal characteristics and a reduced size within the optical transceiver.

A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipater, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

A method includes forming a coating that covers at least part of a conduction substrate, where the conduction substrate is configured to transport thermal energy. The method also includes forming at least part of an optical waveguide on the coating. The optical waveguide includes multiple cladding layers and a core, and the optical waveguide is configured to transport optical signals. The conduction substrate, the coating, and the optical waveguide form an integrated monolithic waveguide structure.