An optical module includes: photoelectric elements including first terminal groups; an integrated circuit including second terminal groups and ground terminals; a carrier substrate; a housing; and a common ground pad. Further, the carrier substrate is fixed to one surface of the housing, the carrier substrate includes signal wiring parts and a ground wiring part, the ground wiring part includes terminal pattern parts, a common pattern part, and a coupling part, each of the terminal pattern parts being disposed between the corresponding signal wiring parts and electrically connected with one of the ground terminals, the common pattern part being disposed on a side where the common ground pad is provided on the carrier substrate, the coupling part electrically connecting each terminal pattern part and the common pattern part, and the ground terminals of the integrated circuit are electrically connected with the common ground pad through the ground wiring part.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.

A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.

A thermal-optical phase shifter includes a substrate layer, a cladding layer, and a beam in the cladding layer. The thermal-optical phase shifter includes a waveguide and a heating element disposed in the beam. The thermal-optical phase shifter includes a thermally conductive structure disposed on the cladding layer to disperse heat from the beam. The thermally conductive structure may include a metal strip disposed longitudinally along the beam, may include thermally conductive pads, and/or may include thermally conductive vias coupled between the cladding layer and the substrate layer. The thermal-optical phase shifter may be incorporated into light detection and ranging (LIDAR) devices, telecommunications devices, and/or computing devices.

An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

An optical module includes: photoelectric elements including first terminal groups; an integrated circuit including second terminal groups and ground terminals; a carrier substrate; a housing; and a common ground pad. Further, the carrier substrate is fixed to one surface of the housing, the carrier substrate includes signal wiring parts and a ground wiring part, the ground wiring part includes terminal pattern parts, a common pattern part, and a coupling part, each of the terminal pattern parts being disposed between the corresponding signal wiring parts and electrically connected with one of the ground terminals, the common pattern part being disposed on a side where the common ground pad is provided on the carrier substrate, the coupling part electrically connecting each terminal pattern part and the common pattern part, and the ground terminals of the integrated circuit are electrically connected with the common ground pad through the ground wiring part.

An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.

A pixel circuit having a function of compensating for characteristic variation of an electro-optical element and threshold voltage variation of a transistor is formed from a reduced number of component elements. An input signal is sampled from a signal line so as to be held in a holding capacitor. The threshold voltage of the drive transistor is imparted to the holding capacitor in order to cancel an influence of the threshold voltage.

An optical module includes at least one optical sub-assembly; at least one control circuit configured to control the at least one optical sub-assembly; and a housing including a first case and a second case, wherein the optical module is configured to be plugged in and unplugged from an optical transmission equipment including a heat sink provided at a joining portion with the first case, wherein, through fitting of the first case and the second case, the housing accommodates the at least one optical sub-assembly and the at least one control circuit inside the housing, and wherein a material of the first case has a thermal conductivity higher than a material of the second case.