A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

An optical device according to one embodiment includes an optical element, a sleeve including a receptacle portion and an insertion portion, and a base having a lower plate having a main surface with the optical element being mounted thereon and a side wall having a hole with the insertion portion of the sleeve optically coupled with the optical element inserted into the hole. A step difference at a position lower than the main surface is formed at a lower position of the hole in the side wall.

An optical communication module is provided, including an input/output connector on one end through which a multi-signal including a video signal is input/output, an optical sub assembly (OSA) package on another end for converting the multi-signal into an optical signal, and a first connection end folded in a curved form so that a connection surface as one surface on which a first contact point is formed forms an outer circumference and a non-connection surface as another surface on which the first contact point is not formed forms an inner circumference to form upper and lower double-sided contacts with the input/output connector. The optical communication module may simplify a contact point structure with an input/output connector and reduce its manufacturing costs, by improving the contact point structure with an input/output connector, and may provide a high-speed transmission line having a relatively-low dielectric loss with respect to a video signal requiring high-speed transmission in synchronization with a high-speed clock signal and also have an improved structure favorable to mounting of an integrated circuit for signal processing with respect to an auxiliary signal or a peripheral circuit device connected to the integrated circuit.

An opto-electric hybrid board is capable of being mounted on a connector having a bottom wall. The opto-electric hybrid board sequentially includes an optical waveguide and an electric circuit board toward one side in a thickness direction of these. The optical waveguide includes an under clad layer, a core layer disposed on a one-side surface of the tinder clad layer, and an over clad layer disposed on the one-side surface of the under clad layer so as to cover the core layer. The under clad layer is in contact with an other-side surface in the thickness direction of the electric circuit board. The one-side surface in the thickness direction of the electric circuit board is capable of being placed on the bottom wall.

A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

A fingerprint identification module includes a light guiding member, a flexible circuit board, two light emitting members, and a fingerprint identification chip. The light guiding member includes a bottom and a protruding edge. The protruding edge surrounds to form a first space. A first through-hole is formed on the bottom. The flexible circuit board is disposed in the first space and has a first portion, a second portion, a third portion, and a fourth portion connected in sequence. The first portion goes out of the light guiding member through the first through-hole. The third portion faces a direction opposite to the bottom. The second portion and the fourth portion face the bottom of the light guiding member. The light emitting members are disposed on the flexible circuit board and face the light guiding member. The fingerprint identification chip is disposed on the third portion of the flexible circuit board.

This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.

Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.5 wavelength or less at frequency corresponding to the bit rate.

An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.