Example embodiments of systems and methods for preventing chip fraud are provided. A chip fraud prevention system may comprise a device including a chip, wherein the chip is at least partially encompassed in a chip pocket. One or more connections may be communicatively coupled to one or more surfaces of the chip, and a capacitance member may be coupled to a surface of the chip. The capacitance member may comprise a known capacitance value and the chip may comprise a memory containing an applet, wherein the applet is configured to measure the capacitance value of the capacitance member.

A method provides a tamper loop status of a radio-frequency transponder to a reader. The transponder communicates with the reader at a first frequency according to a first communication protocol. The transponder includes a first non-volatile memory for storing a first set of data of the first communication protocol. The first memory includes a user memory having two portions and each portion includes a data item specific to a status of the tamper loop. The method is performed by the transponder after receiving a request according to the first protocol to read the user memory and includes generating a logical view of the user memory, the logical view including only one of the two portions that is selected according to a value of a binary parameter representative of a status of the tamper loop. The method also includes providing the logical view to the reader via the first protocol.

A dynamic transaction card that is manufactured using conductive plastic jumpers that will dissolve when in contact with a solvent used to tamper with the dynamic transaction card. Internal components of a dynamic transaction card may be manufactured using a synthetic or semi-synthetic organic material, such as, for example, plastics. These materials may be conductive to provide functionality to a dynamic transaction card, such as a connection between an integrated circuit and other card components such that when the materials dissolve, the connections are broken and the dynamic transaction card may be inactive due to the loss of various connections.

A system for detecting tampering with a product includes a capacitor in or attached to the product, an integrated circuit configured to inject a current the capacitor and to detect a corresponding voltage slope on the capacitor. The integrated circuit is further configured to divide the voltage slope into a plurality of slope segments, discard a first set of slope segments, whose slope value falls outside a predefined range of slope values, and use a second set of slope segments, whose slope value falls within said predefined range, for determining a capacitance on the capacitor. A corresponding method for detecting tampering with a product is conceived, and a corresponding computer program is provided.

An integrated circuit chip (2), an antenna (3) and a tamper loop (4), and in addition to this, a light emitting diode (LED) (20), configured to be activated, i.e. supplied with current, upon a signal received by the antenna (3). The LED (20) is integrated in the device in such a way that when the LED is activated in the above-described way, the LED lights up so as to become visible by the naked eye, on the condition that the tamper loop (4) is in a predefined state, either open or closed. The LED (20) is coupled between the same terminals (8,9) of the integrated circuit chip (2) as the tamper loop (4).

A method for detecting tag tampering on an item located in a venue is provided. The method may include registering a first tag and a second tag with the item, wherein the first tag and the second tag are located on the item. The method may further include pairing the first tag and the second tag that are registered with the item. The method may further include, determining and registering a distance between the first tag and the second tag on the item. The method may further include detecting whether tag tampering occurs on the item, whereby detecting whether tag tampering occurs comprises detecting whether the first tag and the second tag are displaced from the registered distance between the first tag and the second tag associated with the item.

A container arrangement (100) is disclosed, which is preferably destined for pharmaceutical products. The container arrangement includes a container body (110) and a first wireless communication systems (210) composed of a NFC system (210) including an NFC antenna (141). The container arrangement further includes a first and/or a second sensing-switching arrangement (143; 280) configured to include a preset status inhibiting a standardized operability of the first wireless communication system (210). The first sensing-switching arrangement (143) is configured to deregulate its preset status upon an initial opening event and the second sensing-switching arrangement (280) is configured to deregulate its preset status upon an unloading event.

A semiconductor substrate has a front face and a back face. A first contact and a second contact, spaced apart from each other, are located on the front face. An electrically conductive wafer is located on the back face. A detection circuit is configured to detect a thinning of the substrate from the back face. The detection circuit including a measurement circuit that takes a measurement of a resistive value of the substrate between said at least one first contact, said at least one second contact and said electrically conductive wafer. Thinning is detected in response to the measured resistive value.

An integrated circuit chip (2), an antenna (3) and a tamper loop (4), and in addition to this, a light emitting diode (LED) (20), configured to be activated, i.e. supplied with current, upon a signal received by the antenna (3). The LED (20) is integrated in the device in such a way that when the LED is activated in the above-described way, the LED lights up so as to become visible by the naked eye, on the condition that the tamper loop (4) is in a predefined state, either open or closed. The LED (20) is coupled between the same terminals (8,9) of the integrated circuit chip (2) as the tamper loop (4).

A semiconductor die includes a circuit, a plurality of metal layers, a first sawbow line coupled to the circuit, and a second sawbow line coupled to the circuit. The first sawbow line is hidden under a first metal layer of the plurality of metal layers when the first sawbow line is in a cut state. The second sawbow line is hidden under the first metal layer or a second metal layer of the plurality of metal layers when the second sawbow line is in a cut state. The first sawbow line and the second sawbow line are on different ones of the plurality of metal layers. A number of pull-down or pull-up resistors may be included to set the logical states of the sawbow lines, in order to disable a predetermined mode of operation of the die when a wafer including the die is cut. The sawbow lines may carry a variety of types of signals (e.g., analog, digital, random, ground, supply) that makes the nature and value of them extremely hard to detect/hack.