The invention relates to a smart card, which includes: a card body, having an accommodating recess extending along its own thickness direction of the card body; a decorative part, at least part of the decorative part being embedded in the accommodating recess; in which the decorative part includes a base layer and decorative pieces, more than two decorative pieces are arranged on the base layer, the base layer is connected to the card body, the decorative pieces correspond to the accommodating recess along the thickness direction and are exposed to an external environment. The smart card of the invention can improve the stereoscopic sense, individuation and noble sense of the smart card by arranging the decorative parts with decorative pieces on the card body.

Provided are transaction cards with a reduced weight core. In some approaches, a transaction card may include a body having a first outer layer opposite a second outer layer, and a corrugated core between the first outer layer and the second outer layer, wherein the corrugated core comprises a plurality of alternating peaks and valleys coupled to the first outer layer and the second outer layer. The transaction card may further include an identification chip positioned through the first outer layer, wherein the identification chip is directly coupled to the corrugated core.

Apparatus and methods disclosed herein provide technical solution for on-demand manufacturing of a payment instrument that includes an integrated circuit chip. Apparatus and methods provide technical solutions for securely validating and activating the manufactured payment instrument. The customer may submit a request to manufacture a payment instrument through an automated teller machine (“ATM”), online banking channel or mobile banking channel. Apparatus and methods allow a customer to manufacture a payment instrument at home using a 3D printer or use a 3D printer installed at an ATM. Using a secure validation methods, the newly manufactured payment instrument may be activated at an ATM.

A label with RFID function comprises a support layer and an RFID inlay with an RFID chip and an antenna connected to the RFID chip. The RFID inlay is arranged on the support layer. The antenna comprises at least one capacitive element on which the resonant frequency of the antenna depends. By adding the at least one capacitive element to the antenna, the read/write range of the RFID inlay can be increased.

Provided are transaction cards including an infinity mirror. In some approaches, a transaction card may include a body comprising a first reflective layer and a second reflective layer, and a light source between the first reflective layer and the second reflective layer.

Apparatus and methods disclosed herein provide technical solution for on-demand manufacturing of a payment instrument that includes an integrated circuit chip. Apparatus and methods provide technical solutions for securely validating and activating the manufactured payment instrument. The customer may submit a request to manufacture a payment instrument through an automated teller machine (“ATM”), online banking channel or mobile banking channel. Apparatus and methods allow a customer to manufacture a payment instrument at home using a 3D printer or use a 3D printer installed at an ATM. Using a secure validation methods, the newly manufactured payment instrument may be activated at an ATM.

Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

A dual band transponder comprises a carrier substrate having at least one planar substrate layer. An ultra-high frequency loop antenna is mounted on a first surface of one of the planar substrate layers of the carrier substrate. A high frequency loop antenna is mounted on two opposite surfaces of one of the planar substrate layers of the carrier substrate. The ultra-high frequency loop antenna encloses the high frequency loop antenna in a plane parallel to the at least one planar substrate layer entirely. A textile label includes a textile label substrate and a corresponding dual band transponder mounted onto the textile label substrate.

A transaction card, and processes for the manufacture thereof, having a core layer, optionally, one or more layers or coatings over the core layer, and at least one of a magnetic stripe, a machine readable code, and a payment module chip disposed in or on the card and suitable for rendering the card operable for conducting a transaction. The core layer comprises a metal-doped cured epoxy comprised of metal particles distributed in a binder consisting essentially of a cured, polymerized epoxy resin, the core comprising greater than 50%, preferably greater than 75%, and more preferably greater than 90%, of the weight and/or volume of the card. In some embodiments, the core includes a metal insert enveloped with the metal-doped curable epoxy, wherein the periphery of the epoxy extends beyond the periphery of the metal insert and has material properties more conducive to cutting or punching than the metal insert.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.