Apparatuses and methods are provided for manufacturing a transaction card. The disclosed apparatuses and methods may be used to form a transaction card frame configured to house a data storage component. The card frame may be formed of a resin mixture comprising a thermoplastic elastomer (TPE). The card frame may also have a Shore D hardness in the range of 20-80.

An RFID tag in the present disclosure includes an insulating substrate including an upper surface, a coil conductor disposed in the insulating substrate, a semiconductor element mounted on the upper surface of the insulating substrate, and a mold resin covering the upper surface of the insulating substrate and the semiconductor element. The mold resin contains a plurality of magnetic particles having particle sizes different from each other.

The disclosed embodiments generally relate to transaction card constructions, and particularly, to a two-piece transaction card construction. Disclosed embodiments include a generally planar first card component including a first surface and a generally planar second card component including a second surface wherein the first card component is separate from the second card component. In disclosed embodiments, for example, the generally planar first card component and the generally planar second card component may be configured such that one forms a cavity and the other forms an inlay component configured to be seated within the cavity. In other embodiments the generally planar first card component and the generally planar second card component may be configured such that one forms a container and the other forms a lid configured to close the container.

A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

The present invention provides a system and method for packaging RFID device, in which a flexible mold with low surface energy having a mold cavity formed on a surface thereof is provided, an RFID device having RFID chip and antenna coupled thereto is then arranged in the mold cavity, a thermosetting material is filled in the mold cavity under a first atmospheric pressure produced by a pressure controlling device whereby the RFID device is completely covered by the thermosetting material, after that, the pressure controlling device provides a second atmospheric pressure higher than the first atmospheric pressure under a temperature lower than the curing temperature of the thermosetting material, and finally, the temperature is increased to the curing temperature under the second atmospheric pressure for curing the thermosetting material thereby forming an RFID package having the RFID device and the thermosetting material covered the RFID device.

A metal surface card in which the metal surface is formed by a metal insert configured to be retained by interlocking shapes of the metal insert and molded polymer material sandwiched between the metal insert and an opposing surface of the card which is not metal.

An RFID tag is provided that has a rectangular parallelepiped substrate including a top surface, a bottom surface, and four side surfaces, an RFIC chip mounted on the top surface of the substrate, and a coil conductor connected to the RFIC chip. The coil conductor includes a conductor pattern disposed on the top surface, a conductor pattern disposed on the bottom surface, and a plurality of through-hole conductors penetrating the substrate and extending between the top and bottom surfaces. Moreover, a winding axis of the conductor pattern intersects with each of a pair of the side surfaces opposite to each other and having a largest area among the four side surfaces.

A near field communication ring that can be read by nearby NFC-enabled devices. The ring comprises an annular shell and a near field communication transponder mounted on the annular shell. The near field communication transponder has a coil antenna that has a plurality of turns that each extend around the entire circumference of the annular shell. The rings has various potential applications including, for example, contactless payment, ticketing on mass transit systems, operation of NFC door locks or other access systems, identity authentication, venue or event entry/ticketing and the sharing of information with NFC-enabled smartphones.

A method of manufacturing a relay includes a molded resin element step configured to produce a molded resin element with an IC chip is embedded therein by injecting a resin around the IC chip; an assembly step configured to apply the molded resin element to a base material as an exterior jacket component of the relay, the base material serving as the main body of the relay; and an antenna wiring forming step configured to print an antenna wiring on a surface of the molded resin element, the antenna wiring configured to allow the IC chip to perform wireless communication.

Disclosed herein is a rubber coating for an electronic communication module, the coating comprising 100 phr of at least one diene-based elastomer, and at least one nano-sized inorganic material having a dielectric constant of at least 9 and a loss tangent of less than 0.1, wherein the coating when cured has a dielectric constant of at least 4.5 and a loss tangent of less than 0.01. Also disclosed are an electronic communication module comprising a radio device having at least a portion of its outer surface surrounded by the rubber coating (i.e., a rubber composition of specified composition), tires or tire retreads incorporating the electronic communication module, and methods for increasing the dielectric constant of a rubber coating without increasing its loss tangent.