The present application relates to an electronic document module comprising a medium having a so-called internal face provided with at least two contact interfaces with an antenna, each of the contact interfaces with the antenna of the internal face of the medium being configured to be in contact with a connection pad of an antenna of an electronic document body, and with a chip comprising at least one I/O port, and one of the two contact interfaces with the antenna of the internal face of the medium being connected to the I/O port of the chip. The application also relates to an electronic document comprising such a module and a method for checking a connection between the module and a corresponding antenna.

The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.

A method for producing security patterns on an electronic module for a security document includes providing a dielectric film; producing through-holes in the dielectric film; depositing at least one metallic layer on upper and lower faces of the dielectric film leaving the through-holes open; engraving a set of functional metallic zones comprising a central zone forming an electrical ground and a set of electrical contacts separated from one another and separated from the electrical ground by non-metallized zones that expose the dielectric film, and a set of non-functional or decorative zones; and simultaneously engraving a first hollow security pattern by removing material in one of the functional metallic zones, and a second security pattern in relief relative to the dielectric film and obtained by removing material in a zone located outside the functional metallic zones forming the electrical contacts of the terminal block.

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.

A system for sensing a physical property of a fluid flowing inside a composite hose includes a radio frequency identification (RFID) reader arranged to transmit radio frequency signals. An RFID tag receives the radio frequency signals and exchanges the received radio frequency to electrical energy powering the RFID tag. An included sensor electrically connected to the RFID tag receives the electrical energy from the RFID tag and powers the sensor to obtain measurement data of at least one physical property of the fluid and transmit the measurement data to the RFID tag. The RFID tag transmits the measurement data to the RFID reader using the radio frequency.

A modular transaction card assembly includes a card frame having the traditional dimensions of a credit card, and a transaction card that is smaller than a traditional card and that fits into a receptacle of the card frame. Each of the card frame and the transaction card may be capable of performing contactless data transactions individually. The combined assembly of the card frame with the transaction card secured in the receptacle is also capable of performing contact data transactions. The transaction card and/or the card frame may include one or more visual or tactile regions that allow the transaction card and card frame to be distinguished from other cards and/or to be properly oriented and aligned with one another when combined to form the card assembly.

Provided are approaches for removing a chip of a transaction card using a chip removal element. In some approaches, the transaction card may include a body including a first main side opposite a second main side, a chip coupled to the first main side of the body, and a chip removal element disposed between the chip and the body. A first end of the chip removal element may be positioned within a tab recess along the first main side of the body, wherein the chip removal element is operable to decouple the chip from the body when the chip removal element is moved away from the body.

A transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF) may be in the form of a conductive layer having an outer edge (OE) and a slit (S) or non-conductive stripe (NCS) extending from the outer edge to an inner position thereof which may be a central opening (OP). The coupling frame (CF) may be arranged so that the slit (S) or non-conductive strips (NCS) overlaps at least a portion of the module antenna (MA). Methods and apparatus are disclosed.

In various embodiments, a chip card module for a chip card is provided. The chip card module may include a carrier with a first side and an opposite second side, a chip arranged over the first side of the carrier, an antenna arranged over the carrier. The antenna may be electrically conductively coupled to the chip and configured to inductively couple to a second antenna formed on a chip card body of the chip card. The chip card module may further include a capacitor electrically conductively coupled to the chip, the capacitor including a first electrode arranged over the first side of the carrier, and a second electrode arranged over the second side of the carrier.