A process for making a transaction card defined by a plurality of layers is described. The process includes providing a first portion of the card, the first portion comprising a non-plastic layer having first and second faces and a thickness therebetween; forming an opening in the non-plastic layer, the opening defined through the first face; disposing embedded electronics in the opening; providing a second portion of the card; and providing a fill disposed in portions of the opening not occupied by the embedded electronics and attaching the first portion of the card to the second portion of the card.

A transaction card (smartcard) having a front “continuous” (with no slit) metal layer (ML, CML) with an opening (MO) for a dual-interface transponder chip module (TCM) having a module antenna (MA) on its bond side. A magnetic shielding layer (MSL) comprising ferrite material disposed below the front face continuous metal layer. An amplifying element, booster antenna circuit (BAC) disposed under the magnetic shielding layer. A rear discontinuous metal layer (ML, DML) with a slit (S) and a metal ledge surrounding the module opening to function as a coupling frame (CF). A rear plastic layer formed of non-RF impeding material may support a magnetic stripe and security elements (signature panel and hologram). A portion of the front face continuous metal layer may protrude downward into the magnetic shielding layer and booster antenna circuit layer. The rear discontinuous metal layer may have an additional slit to regulate the activation distance.

A method for manufacturing a payment card which includes the steps of forming a shield layer which includes ferromagnetic material; forming an inlay wherein the inlay includes an antenna and an interior edge forming a hole; forming a metal layer which includes a recess sized to receive the shield layer; and placing the shield layer into the recess of the metal layer. The shield layer further includes an opening sized to receive an integrated circuit (“IC”) chip. The recess is formed within a boundary of the metal layer and on a first side of the metal layer, the recess including an opening through to a second side of the metal layer. The opening of the recess and the opening of the shield layer are sized to receive the IC chip, of which includes a contact area.

Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).

A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.

A transaction card (smartcard) having a front “continuous” (with no slit) metal layer (ML, CML) with an opening (MO) for a dual-interface transponder chip module (TCM) having a module antenna (MA) on its bond side. A magnetic shielding layer (MSL) comprising ferrite material disposed below the front face continuous metal layer. An amplifying element, booster antenna circuit (BAC) disposed under the magnetic shielding layer. A rear discontinuous metal layer (ML, DML) with a slit (S) and a metal ledge surrounding the module opening to function as a coupling frame (CF). A rear plastic layer formed of non-RF impeding material may support a magnetic stripe and security elements (signature panel and hologram). A portion of the front face continuous metal layer may protrude downward into the magnetic shielding layer and booster antenna circuit layer. The rear discontinuous metal layer may have an additional slit to regulate the activation distance.

An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor. A distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor.

A smart card module including a contact region with at least one electrical smart card module contact, and a verification code display unit configured to display a verification code, the verification code display unit being arranged in the smart card module, wherein the verification code display unit is configured as a dynamic permanent display unit, the controlled display of which continues to be displayed after deenergization of the verification code display unit.

The invention relates to an electrical circuit, for example of the printed circuit type, for producing a module intended to be integrated into a chip card. This module has electrical contact—or connector—areas for the connection and communication of the chip to and with a read/write system. In order to give them a different colour from the gilded or silvered ones generally used, these electrical contact areas are at least partially covered with a surface layer comprising a compound of XpOqNrCs type, in which X may be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, with p, q>0 and r≥0 and/or s≥0. The invention also relates to a method for manufacturing such an electrical circuit.