An RFIC device including a resin block having a first surface, a second surface that faces the first surface, and a through-hole that extends through the first surface and the second surface. Moreover, the RFIC device includes an RFIC element that is embedded in the resin block and a coil antenna disposed in the resin block that is connected with the RFIC element and that has a central axis that extends from the first surface to the second surface. In addition, the through-hole extends inside the coil antenna.

According to an embodiment of the present invention, the electronic price indicator comprises: a base substrate; a first mounting unit formed on the base substrate, on which a first antenna for receiving product-related information from a server is mounted; a second mounting unit formed on the base substrate, on which a first communication module connected to the first antenna is mounted; a third mounting unit formed on the base substrate, on which a second antenna for receiving a management signal from a management terminal is mounted; a fourth mounting unit formed on the base substrate, on which a second communication module connected to the second antenna is selectively mounted; and a fifth mounting unit formed on the base substrate, selectively and directly connected to any one of the second antenna and the second communication module, and provided with a low frequency (LF) circuit mounted thereon to transmit an interrupt in accordance with the management signal to the first communication module.

A payment card (e.g., credit and/or debit card) is provided with a magnetic emulator operable to act as a magnetic stripe read-head detector and a data transmitter. A multiple layer flexible PCB may be fabricated to include multiple magnetic emulators. An emulator may include a coil that includes magnetic, ferromagnetic, or ferromagnetic, material in the coil's interior. Coils may be associated with zones. As a read-head is detected to move from zone-to-zone, coils may be activated to transmit information in those zones.

The invention relates to a transponder layer (10), in particular for producing a chip card, having an antenna substrate (12), which, on an antenna side (11), is equipped with an antenna (14) formed from a wire conductor (13), and has a chip accommodation which is formed by a recess in the antenna substrate and in which a chip (21) is accommodated, wherein wire conductor ends, which serve to form terminal ends (15) of the antenna, are formed at a bottom (20) of the chip accommodation which is recessed with respect to the rear side (26) of the antenna substrate (12), and the chip is accommodated in the chip accommodation in such a manner that terminal contacts (22) arranged on a contact side (36) of the chip are contacted with flat contact portions (19) of the terminal ends (15), and the chip is arranged with the rear side (27) of its semiconductor body (28) facing the terminal contacts substantially flush with the rear side of the antenna substrate. Furthermore, the invention relates to a method for producing a transponder layer.

A method of manufacturing a device with a planar electrode structure, the method comprising: (a) forming a microfluidic channel on a substrate; (b) applying a primer layer to at least part of the microfluidic channel, (c) applying a conductive liquid to the microfluidic channel, the conductive liquid comprising electrically conductive particles dispersed in a carrier medium, the carrier medium including a solvent; (d) allowing the conductive liquid to flow throughout the microfluidic channel by capillary action to form the planar electrode structure; and (e) evaporating the solvent from the carrier medium, is described. Devices obtainable using the method and their applications are also described.

A method and system for communicating estimated blood loss parameters of a patient to a user, the method comprising: receiving data representative of an image, of a fluid receiver; automatically detecting a region within the image associated with a volume of fluid received at the fluid receiver, the volume of fluid including a blood component; calculating an estimated amount of the blood component present in the volume of fluid based upon a color parameter represented in the region, and determining a bias error associated with the estimated amount of the blood component; updating an analysis of an aggregate amount of the blood component and an aggregate bias error associated with blood loss of the patient, based upon the estimated amount of the blood component and the bias error; and providing information from the analysis of the aggregate amount of the blood component and the aggregate bias error, to the user.

Methods for manufacturing RFID devices are provided with self-limiting heating features. Inducing current flow through the antenna of an RFID device (e.g., by exposing the antenna to a changing magnetic field) will increase heat of the RFID device, thereby curing/sintering elements of the RFID device (which may include curing an adhesive used to couple the antenna to an RFID chip) without applying external heat, which typically heats regions of the RFID device that were not intended to be heated (e.g., the substrate to which the antenna is secured). Inducing current flow through the antenna of an RFID device will reduce the resistance of the antenna, which has a heat-limiting effect that prevents overheating of the RFID device. Inducing current flow may also change the resonant frequency of the antenna, which may provide another heat-limiting effect.

Methods, apparatuses and systems for radio frequency identification (RFID)-enabled information collection are disclosed, including an enclosure, a collector coupled to the enclosure, an interrogator, a processor, and one or more RFID field sensors, each having an individual identification, disposed within the enclosure. In operation, the interrogator transmits an incident signal to the collector, causing the collector to generate an electromagnetic field within the enclosure. The electromagnetic field is affected by one or more influences. RFID sensors respond to the electromagnetic field by transmitting reflected signals containing the individual identifications of the responding RFID sensors to the interrogator. The interrogator receives the reflected signals, measures one or more returned signal strength indications (“RSSI”) of the reflected signals and sends the RSSI measurements and identification of the responding RFID sensors to the processor to determine one or more facts about the influences. Other embodiments are also described.

A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.

Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.