A system for monitoring internal corrosion of a pipeline based on radio-frequency identification (RFID), including a magnetizing device, a RFID tag sensor, and a reader. The magnetizing device is placed on the pipeline, and includes an armature, a first permanent magnet, a first pole shoe, a second permanent magnet and a second pole shoe. The RFID tag sensor is placed on the pipeline, and at the same side with the magnetizing device. The reader is in wireless communication connection with the RFID tag sensor through a reader antenna.

The present invention relates to an RFID tagged and identified cookware in robotic or automated cooking system for identification of each one of the cooking vessels throughout the variety of stages of the cooking processes or meal preparation processes in automated or robotic cooking apparatus through an integrated RFID tag.

A contactlessly readable tag includes a metal pattern layer, a conductive layer, and at least one intermediate layer. The intermediate layer has a relative permittivity of 0 or more and 2.5 or less and is provided between the metal pattern layer and the conductive layer. The metal pattern layer includes a metal part whose arrangement pattern corresponds to identification information. The identification information is configured to be identified based on information on an electromagnetic wave that is reflected by the contactlessly readable tag in response to irradiation of the contactlessly readable tag with an electromagnetic wave. The metal pattern layer is provided closer to a reading surface of the contactlessly readable tag than at least one of the intermediate layer.

Metal layers (650, 730, 750, 830, 850) of a smartcard (SC, 600, 700, 800) have module openings (614, 712, 714, 812, 814) for receiving a transponder chip module (TCM). Thermosetting resin (TR, 668B, 768A, 768B, 868A, 868B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer (650, 750, 850) may have a slit (S; 620, 720B, 820) which may also be filled by the thermosetting resin. A second metal layer (ML, 730) disposed above the first metal layer (750) may have a slit (S, 720A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC, 844) may be disposed between the first and second metal layers, with magnetic shielding material (842) disposed between the booster antenna circuit and the second metal layer (730).

A flexible chip card such as a credit card or a debit card that incorporates a protective layer that precludes unauthorized access to the chip in the chip card. The protective layer is a highly conductive layer that shields the chip and prevents electromagnetic waves that may be emitted by an illicit device from accessing the chip. This protective layer thus prevents any unauthorized persons from obtaining confidential information from the chip card that may then be used to consummate fraudulent transactions or conduct other illicit activities. In one embodiment, the flexible chip card includes one or more stiffening structures to provide rigidity to the chip card.

A smart card including an upper metal layer and a lower metal layer disposed opposite each other; an internal cavity arranged between the upper and lower metal layers; and an RF antenna disposed in the internal cavity; in which the upper and lower metal layers each include a partially recessed area opposite the RF antenna, each partially recessed area including at least one opening through the thickness of the metal layer and each partially recessed area being partially covered by at least one metal protrusion extending from one edge of the partially recessed area so as to define the contour of the at least one opening.

An insert assembly, insertable in a handpiece of a medical device, has an insert having an insert metal tang, a ferromagnetic layer in contact with the insert metal tang, a dielectric layer in contact with the ferromagnetic layer, an insert antenna in contact with the dielectric layer, having an insert antenna metal element and configured to receive and transmit electromagnetic fields, and an identification chip operatively connected to the insert antenna and configured to transmit information about the insert assembly. The ferromagnetic layer reduces or cancels attenuation and/or distortion phenomena of an electromagnetic field caused by parasitic effects due to interaction of a transmitted or received electromagnetic field with metal parts of the insert metal tang, liquids present in the insert, and the insert antenna metal element. The ferromagnetic layer dielectric layer and insert antenna form a transceiver device putting the identification chip in communication with a handpiece antenna.

Example embodiments relate to radio-frequency identification (RFID) tags for liquid monitoring. An example RFID tag includes an antenna configured to communicate with an RFID reader. The antenna includes a radiating plane. The antenna also includes a ground plane. The RFID tag is attachable to a container. A reactance associated with the antenna is modifiable based on a temperature and a volume of a liquid within the container and adjacent to the ground plane. The RFID tag also includes an integrated circuit that includes a memory. The integrated circuit is configured to modulate the antenna in response to an RFID signal from the RFID reader based on the reactance associated with the antenna.

A chip card configured as a metal card is RFID-capable on both sides, by the windings of the transponder coil being formed by the metal layer itself. Gaps between the windings of the transponder coil are filled with insulating material. A chip module is arranged above the ends of the transponder coil such that these ends are not visible for the viewer.

The present invention relates to card-type information substrates, such as payment cards, in which a frame is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.