The invention generally relates to a system for achieving reduced head-media spacing (HMS) in a hard disk drive (HDD) by providing active control over the positioning of a read/write head relative to a rotating magnetic data recording and reading surface of a disk. The system is configured to monitor and adjust positioning of the read/write head in real, or near-real time during disk rotation to maintain the HMS between a magnetic transducer of the read/write head and the disk surface within a defined range, generally between 1.0 nm and 10.0 nm, and, in some embodiments, approximately 4.3 nm. The system replaces the conventional an air bearing surface (ABS) design with a fully active suspension to maintain the head flying height within the desired range. The system further allows for each of the magnetic transducer and disk surface to be to be devoid of any overcoat or lubricant layers.

According to one embodiment, a magnetic disk device includes a magnetic disk, a gimbal, and a controller. The magnetic disk rotates around a first axis. The gimbal includes a magnetic head and a piezoelectric element. The piezoelectric element is deformed in accordance with an applied drive voltage to move the magnetic head. The controller applies a polarization voltage to the piezoelectric element to give spontaneous polarization to the piezoelectric element. The polarization voltage satisfies a relationship of V=(2f)A.Math.T<Vmax, where V is a voltage change amount of the polarization voltage per unit time, f is a frequency of the polarization voltage, A is an amplitude of the polarization voltage, T is a time resolution of the polarization voltage, and Vmax is a voltage change amount per unit time that excites resonance of the gimbal in application to the piezoelectric element.

A magnetic recording head includes a piezoelectric actuator for controlling head-media spacing. A method for making the magnetic recording head including a piezoelectric actuator includes the steps of: providing a source wafer on which to fabricate the piezoelectric actuator; providing a target wafer; fabricating the piezoelectric actuator on the source wafer; releasing the piezoelectric actuator from the source wafer; and placing the piezoelectric actuator on the target wafer.