Memory devices and systems with configurable die refresh stagger, and associated methods, are disclosed herein. In one embodiment, a memory system includes two or more memory dies. At least one memory die includes a fuse array storing refresh information that specifies a refresh group of the memory die. In these and other embodiments, at least one memory die includes a refresh group terminal and refresh group detect circuitry electrically connected to the refresh group terminal. The at least one memory die is configured to detect a refresh group of the memory die and to delay its refresh operation by a time delay corresponding to the refresh group. In this manner, refresh operations of the two or more memory dies can be staggered to reduce peak current demand of the memory system.

Row addresses received by a module are mapped before being received by the memory devices of the module such that row hammer affects different neighboring row addresses in each memory device. Thus, because the mapped respective, externally received, row addresses applied to each device ensure that each set of neighboring rows for a given row address received by the module is different for each memory device on the module, row hammering of a given externally addressed row spreads the row hammering errors across different externally addressed rows on each memory device. This has the effect of confining the row hammer errors for each row that is hammered to a single memory device per externally addressed neighboring row. By confining the row hammer errors to a single memory device, the row hammer errors are correctible using a SDDC scheme.

A method to perform an on demand refresh operation of a memory sub-system is disclosed. The method includes identifying a temporal attribute of user data stored in the memory component, upon determining that the identified temporal attribute satisfies a time condition, providing an indication whether a refresh operation of the user data improves performance of the memory component, receiving an indication to perform the refresh operation of the memory component, and responsive to a time between the refresh operation and a previously performed refresh operation not satisfying a threshold criterion, refraining from performing the refresh operation of the memory component.

A dynamic random access memory (DRAM) and an operation method thereof are provided. The DRAM includes a memory cell array, a refresh counter, a row hammer logic circuit, and a refresh logic circuit. The memory cell array includes a plurality of memory cell rows. The refresh counter provides a current refresh word line address. The row hammer logic circuit provides a victim word line address. The refresh logic circuit refreshes a target row during a first sub-period of a tRFC by using the current refresh word line address to perform an automatic refresh operation. The refresh logic circuit refreshes a victim row during a second sub-period of the same tRFC for row hammer protection by using the victim word line address.

Embodiments of the disclosure are drawn to apparatuses and methods for content addressable memory (CAM) cells. Each CAM cell may include a comparator portion which stores a bit of information. Each CAM cell may also include a comparator portion, which compares an external bit to the stored bit. A group of CAM cells may be organized into a CAM register, with each CAM cell coupled in common to a signal line. Any of the CAM cells may change a voltage on the signal line if the external bit does not match the stored bit.

A method for performing a refresh operation based on system characteristics is provided. A The method includes determining that a current operation condition of a memory component is in a first state and detecting a change in the operation condition from the first state to a second state. The method further includes determining a range of the operation condition to which the second state belongs. The method further includes determining a refresh period associated with the range of the operation condition, the refresh period corresponding to a period of time between a first time when a write operation is performed on a segment of the memory component and a second time when a refresh operation is to be performed on the segment. The method further includes performing the refresh operation on the memory component according to the refresh period.

A memory includes a plurality of rows, each of which is coupled to a plurality of memory cells; a target row determining circuit suitable for determining a row that is likely to lose data among the plurality of rows as a target row; and a transfer circuit suitable for transferring, when a number of target rows determined by the target row determining circuit is equal to or greater than a threshold value, information representing that the number of target rows reaches the threshold value to a memory controller.

A block of dynamic memory in a DRAM device is organized to share a common set of bitlines may be erased/destroyed/randomized by concurrently activating multiple (or all) of the wordlines of the block. The data held in the sense amplifiers and cells of an active wordline may be erased by precharging the sense amplifiers and then writing precharge voltages into the cells of the open row. Rows are selectively configured to either be refreshed or not refreshed. The rows that are not refreshed will, after a time, lose their contents thereby reducing the time interval for attack. An external signal can cause the isolation of a memory device or module and initiation of automatic erasure of the memory contents of the device or module using one of the methods disclosed herein. The trigger for the external signal may be one or more of temperature changes/conditions, loss of power, and/or external commands from a controller.

Apparatuses, systems, and methods for sketch circuits for refresh binning. The rows of a memory may have different information retention times. The row addresses may be sorted into different bins based on these information retention times. In order to store information about which row addresses are associated with which bins a sketch circuit may be used. When an address is generated as part of a refresh operation, it may be used to generate a number of different hash values, which may be used to index entries in a storage structure. The entries may indicate which bin the address is associated with. Based on the binning information, the memory may refresh the address at different rates (e.g., by determining whether to provide the address as a refresh address or not).

A refresh circuit includes: a signal generation module, configured to generate an inversion signal and a carry signal based on a refresh command; an adjustment unit, configured to generate, if a first refresh signal and a second refresh signal are generated based on the refresh command, an inversion adjustment signal according to the inversion signal, and generate, if only the first refresh signal is generated based on the refresh command, the inversion adjustment signal according to an inversion signal corresponding to a first refresh signal generated based on a current refresh command, and generate the inversion adjustment signal only according to an inversion signal corresponding to a second refresh signal generated based on a next refresh command; and a counting module, configured to generate a first output signal and a second output signal, and invert the first output signal based on the inversion adjustment signal.