A memory device is provided. The memory device includes a plurality of memory chips that are stacked, wherein each of the memory chips includes a memory cell array, which includes a plurality of memory cell rows, a chip identifier generator configured to generate a chip identifier signal indicating a chip identifier of each of the memory chips, a refresh counter configured to generate a target row address for refreshing the memory cell rows in response to a refresh command, and a target row address generator, which receives the chip identifier signal and the target row address and outputs one of the target row address and an inverted target row address, obtained by inverting the target row address, as a refresh row address based on the chip identifier signal, and performs a refresh operation on a memory cell row corresponding to the refresh row address.

A computer-implemented method includes refreshing a set of memory channels in a memory system substantially simultaneously, each memory channel refreshing a rank that is distinct from each of the other ranks being refreshed. Further, the method includes marking a memory channel from the set of memory channels as being unavailable for the rank being refreshed in the memory channel. In one or more examples, the method further includes blocking a fetch command to the memory channel for the rank being refreshed in the memory channel.

A memory chip may include: a plurality of memory banks; a data storage configured to store access information indicative of access operations for one or more segments of the plurality of memory banks; and a refresh controller configured to perform a refresh operation of the one or more segments based, at least in part, on the stored access information.

Memory devices and systems with configurable die refresh stagger, and associated methods, are disclosed herein. In one embodiment, a memory system includes two or more memory dies. At least one memory die includes a fuse array storing refresh information that specifies a refresh group of the memory die. In these and other embodiments, at least one memory die includes a refresh group terminal and refresh group detect circuitry electrically connected to the refresh group terminal. The at least one memory die is configured to detect a refresh group of the memory die and to delay its refresh operation by a time delay corresponding to the refresh group. In this manner, refresh operations of the two or more memory dies can be staggered to reduce peak current demand of the memory system.

Embodiments of the disclosure are drawn to apparatuses and methods for a sequence of refreshing memory mats. During a refresh operation, wordlines of the memory may be refreshed in a sequence. Groups of wordlines may be organized into memory mats. In order to prevent noise, each time a wordline in a memory mat is refreshed, the next wordline to be refreshed may be in a mat which is not physically adjacent to the mat containing the previously refreshed wordline.

A memory device may include a phase driver circuit that may output a first voltage for refreshing a plurality of memory cells. The memory device may also include a plurality of word line driver circuits that may receive the first voltage via the phase driver circuit, such that each word line driver circuit of the plurality of word line driver circuits may provide the first voltage to a respective word line associated with a respective portion of the plurality of memory cells. In addition, each word line driver circuit may refresh the respective portion of the plurality of memory cells based on a respective word line enable signal provided to a first switch of the respective word line driver circuit.

A memory processing unit architecture can include a plurality of memory regions and a plurality of processing regions interleaved between the plurality of memory regions. The plurality of processing regions can be configured to perform computation functions of a model such as an artificial neural network. Data can be transferred between the computation functions in respective memory processing regions. In addition, the memory regions can be utilized to transfer data between a computation function in one processing region and a computation function in another processing region adjacent to the given memory region.

A semiconductor system including: an operation period adjusting circuit configured to generate operation information for adjusting an operation period, when an input count of an active command during a test mode period is equal to or more than a preset count; and a command generation circuit configured to adjust the input count of the active command applied to a semiconductor device during a preset period, by adjusting the operation period on the basis of the operation information.

Embodiments of the disclosure are drawn to apparatuses and methods for staggering the timing of skipped refresh operations on a memory. Memory cells of memories may need to periodically perform refresh operations. In some instances, auto-refresh operations may be periodically skipped when charge retention characteristics of the memory cells of the memory exceed the auto-refresh frequency. To reduce peak current draw during refresh operations, the skipped refresh operations may be staggered across different portions of the memory. In one example, the skipped refresh operation may be staggered in time among memory dies of the memory to limit a number of memory dies that are performing an auto-refresh operation to a maximum number. In another example, the skipped refresh operation may be staggered in time among memory banks of a single memory array to limit a number of memory banks that are performing an auto-refresh operation to a maximum number.

A row hammer preventing circuitry including: a first table storing a count value representing a hit count and an address bit of multiple entries, each entry corresponding to access-requested target rows; a second table including safe bits and a safe bit counter; and a row hammer preventing logic to identify masking entries, on which a masking comparison is to be performed, among the entries on the basis of the safe bit counter, to determine a hit or miss on the basis of whether other bits except an MSB among address bits of an access-requested target row match other bits except an MSB among address bits of the masking entries, and to generate a control signal indicating an additional refresh on rows adjacent to rows corresponding to a masking entry whose hit count is greater than a threshold value.