Briefly, embodiments of claimed subject matter relate to backup of parameters, such as binary logic values, stored in nonvolatile memory, such as one or more SRAM cells. Binary logic values from a SRAM cell, for example, may be stored utilizing resistance states of a magnetic random-access memory (MRAM) element. Parameters stored in one or more MRAM elements may be restored to SRAM memory cells following a backup.

A method for storing information in SRAM bit cell arrays provides for lowering voltage supplied to the SRAM bit cell arrays, with voltage lowering controlled by a connected voltage control circuit. Writing, reading, and correcting information storable in the SRAM bit cell arrays is accomplished using an error correcting code (ECC) block connected to at least some of the SRAM bit cell arrays. The ECC block is configurable to repair stored information.

A semiconductor memory device includes a first data input/output (I/O) pad, an X-ray detector and a second data I/O pad. The first data I/O pad receives a test signal. The X-ray detector is connected to the first data I/O pad, includes a bipolar junction transistor (BJT) in which a voltage between an input end and an output end changes according to a cumulative X-ray dosage to the semiconductor memory device, and generates a test result signal indicating the voltage between the input and output ends of the BJT based on the test signal. The second data I/O pad is connected to the X-ray detector and outputs the test result signal.

A logic circuit in a system LSI (Large Scale Integrated Circuit) is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM (Static Random Access Memory) circuit of the system LSI controls a substrate bias to reduce leakage current.

A method for controlling power supply in a semiconductor device including a CPU and a PLD which can hold data even in an off state is provided. The semiconductor device includes a processor, a programmable logic device, and a state control circuit. The programmable logic device includes a first nonvolatile memory circuit and has a function of holding data obtained by arithmetic processing of the programmable logic device when it is turned off. The state control circuit obtains data on the amount of a task performed by the programmable logic device in accordance with an operation of the processor. The programmable logic device detects the state of progress of the task and outputs a signal to the state control circuit. The state control circuit monitors the amount of the task and the state of progress of the task and turns off the programmable logic device when the task is completed.

A semiconductor memory having a memory cell structure capable of reducing soft error without complicating a circuit configuration. Specifically, an inverter (I1) consists of a NMOS transistor (N1) and a PMOS transistor (P1), and an inverter (I2) consists of a NMOS transistor (N2) and a PMOS transistor (P2). The inverters (I1, I2) are subjected to cross section. The NMOS transistor (N1) is formed within a P well region (PW0), and the NMOS transistor (N2) is formed within a P well region (PW1). The P well regions (PW0, PW1) are oppositely disposed with an N well region (NW) interposed therebetween.

A random bit cell includes a latch, a voltage selector, a first non-volatile storage element, and a second non-volatile storage element. The latch has a first terminal coupled to a first local bit line, and a second terminal coupled to a second local bit line. The first non-volatile storage element has a first terminal coupled to the first local bit line, and a second terminal coupled to the voltage selector. The second non-volatile storage element has a first terminal coupled to the second local bit line, and a second terminal coupled to the voltage selector. During an initial operation, the first terminals of the first non-volatile storage element and the second non-volatile storage element are floating. During an enroll operation, the first terminals of the first non-volatile storage element and the second non-volatile storage element receive a program voltage from the voltage selector.

A latch is provided. The latch includes a plurality of storage nodes including a plurality of data storage nodes configured to store a data bit having one of two states and a plurality of complementary data storage nodes configured to store a complement of the data bit. The latch includes a plurality of supply voltage multi-dependency stages respectively corresponding to the plurality of storage nodes. Each supply voltage multi-dependency stage has an output coupled to a storage node and at least two control inputs respectively coupled to at least two other storage nodes of the plurality of storage nodes. The supply voltage multi-dependency stage is configured to cause a state of the data bit stored in the storage node to change from a first state to a second state in response a change in both states of two data bits respectively stored in the at least two other storage nodes.

An autonomous device for detecting characteristics of a medium to be measured is disclosed. The device includes a sensor, a first microcontroller and a second microcontroller. The first microcontroller has a memory which is not resistant against gamma radiation during the sterilization of the device and the second microcontroller has a memory which is resistant against gamma radiation during the sterilization of the device.

Described are techniques for generating a supply voltage for an SRAM array using power switching logic. The power switching logic can generate the supply voltage using a first supply rail (supplying a higher voltage) during an active state and using a second supply rail (supplying a lower voltage) during a deep retention state. In some examples, a sensing and recovery (SR) unit is provided to sense a decrease in the second voltage, for instance, during the deep retention state. The SR unit can generate an additional voltage that modifies the supply voltage to be higher than the decreased second voltage, thereby reducing droop and/or noise in the second supply rail. The power switching logic, SR unit, and SRAM array can be co-located or distributed across a computer system. For instance, the power switching logic, SR unit, and SRAM array can be embedded within a System on Chip integrated circuit.