Memory devices might include a controller for access of an array of memory cells and a differential storage device comprising a pair of gate-connected non-volatile memory cells, wherein the controller is configured to cause the memory device to obtain information indicative of a data value stored in a particular memory cell of the array of memory cells, program additional data to the particular memory cell, determine if a power loss to the memory device is indicated while programming the additional data to the particular memory cell, and, if a power loss to the memory device is indicated, selectively program one memory cell of the pair of gate-connected non-volatile memory cells responsive to the information indicative of the data value stored in the particular memory cell.

Examples described herein relate to a decision tree computation system in which a hardware accelerator for a decision tree is implemented in the form of an analog Content Addressable Memory (a-CAM) array. The hardware accelerator accesses a decision tree. The decision tree comprises of multiple paths and each path of the multiple paths includes a set of nodes. Each node of the decision tree is associated with a feature variable of multiple feature variables of the decision tree. The hardware accelerator combines multiple nodes among the set of nodes with a same feature variable into a combined single node. Wildcard values are replaced for feature variables not being evaluated in each path. Each combined single node associated with each feature variable is mapped to a corresponding column in the a-CAM array and the multiple paths of the decision tree to rows of the a-CAM array.

A ternary content addressable memory (TCAM) semiconductor device includes a first and second data storage portions each connected to a bit line. The first data storage portion is connected to a first word line, and to a first and third group of in series transistors. The second data storage portion is connected to a second word line, and to a second and fourth group of in series transistors. The first group and second group of in series transistors are each connected to a first match line. The first group is connected to a first search line bar, and the second group is connected to a first search line. A third and fourth group of in series transistors are each connected to a second match line. The third group is connected to a second search line, and the fourth group is connected to a second search line bar.

A memory device includes at least one bitcell; read circuitry coupled to the at least one bitcell; and screening circuitry coupled to the read circuitry, wherein the screening circuitry includes a master slave flip-flop configured to store an output of the at least one bitcell during a read operation of the memory device, wherein the master slave flip-flop includes a master latch and a slave latch; and a DOUT window controller coupled to the master slave flip-flop and configured to generate and control a master clock signal for the master latch to determine if the at least one bitcell is a weak bitcell; and generate and control a slave clock signal for the slave latch to enable toggling of the output of the at least one bitcell during a transparent window between the master clock signal and the slave clock signal.

An exemplary memory bit cell circuit, including a bit line coupled to an SRAM bit cell circuit and an NVM bit cell circuit, with reduced area and reduced power consumption, included in a memory bit cell array circuit, is disclosed. The SRAM bit cell circuit includes cross-coupled true and complement inverters and a first access circuit coupled to the bit line. The NVM bit cell circuit includes an NVM device coupled to the bit line by a second access circuit and is coupled to the SRAM bit cell circuit. Data stored in the SRAM bit cell circuit and the NVM bit cell circuit are accessed based on voltages on the bit line. A true SRAM data is determined by an SRAM read voltage on the bit line, and an NVM data in the NVM bit cell circuit is determined by a first NVM read voltage on the bit line.

According to one or more embodiments, an apparatus comprising a plurality of dice latches, dice latch control logic, and a plurality of data input logic is provided. The dice latches are coupled in parallel and latch respective data. The dice latch control logic receives a load control signal and a reset control signal, provides a reset signal and further provides first and second load signals to the dice latches. The reset signal is based on the reset control signal. The first and second load signals are based on the load control signal and the reset control signal. The data input logic each are coupled to a respective one of the dice latches. Each of the data input logic receives a precharge control signal and respective input data and further provides data and complementary data to the respective one of the dice latches.

An apparatus may include a first inverter and a second inverter cross-coupled between a first node and a second node to store a signal state represented by complementary voltages at the first node and the second node. The apparatus may further include a first path defined by the second inverter that includes an impedance element to resist a flow of charge suitable to change the signal state. The apparatus may further include the first inverter and a third inverter selectively cross-coupled between the first node and the second node to store a received signal state represented by the complementary voltages at the first node and the second node responsive to an assertion of a write enable signal.

The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.

A static random access memory including at least one memory cell is provided. The memory cell includes a first inverter, a second inverter, a first pass gate transistor, a second pass gate transistor, a first non-volatile memory, and a second non-volatile memory. The first inverter and the second inverter are coupled to each other. The first pass gate transistor is coupled between the first inverter and the first bit line. The second pass gate transistor is coupled between the second inverter and the second bit line. The first non-volatile memory is coupled between the first pass gate transistor and the first bit line. The second non-volatile memory is coupled between the second pass gate transistor and the second bit line.

The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.