The abstract of the disclosure was objected to because of informality (e.g. format, reference to figures, etc.). See MPEP § 608.01 (b). Please amend the abstract to recite: Non-volatile memory device may include at least an array of memory cells. The non-volatile memory cells may include associated decoding and sensing circuitry and a memory controller. Methods for checking the erasing phase of a non-volatile device may include performing a dynamic erase operation of at least a memory block and storing in a dummy row at least an internal block variable of the dynamic erase operation and/or a known pattern.

A memory apparatus and method of operation is provided. The apparatus has blocks each including non-volatile storage elements. Each of the non-volatile storage elements stores a threshold voltage representative of an element data. The apparatus also includes one or more managing circuits configured to erase at least one of the blocks in an erase operation and program the element data in a program operation. The one or more managing circuits are also configured to proactively identify ones of the blocks as potential bad blocks and selectively apply stress to the ones of the blocks identified as the potential bad blocks and determine whether the potential bad blocks should be retired from the erase and program operations and put in a grown bad block pool or released to a normal block pool used for the erase and program operations based on a judgment after selectively applying the stress.

A nonvolatile memory device includes a memory block including a first structure formed on a substrate and a second structure formed on the first structure. An erase method of the nonvolatile memory device includes applying a word line erase voltage to first normal word lines of the first structure and second normal word lines of the second structure, and applying a junction word line erase voltage smaller than the word line erase voltage to at least one of a first junction word line of the first structure and a second junction word line of the second structure. The first junction word line is a word line adjacent to the second structure from among word lines of the first structure, and the second junction word line is a word line adjacent to the first structure from among word lines of the second structure.

A semiconductor memory device includes: first pad transmitting and receiving first timing signal; second pad transmitting and receiving data signal in response to the first timing signal; third pad receiving second timing signal; fourth pad receiving control information in response to the second timing signal; memory cell array; sense amplifier connected to the memory cell array; first register connected to the sense amplifier; second register storing first control information; third register storing second control information; and control circuit executing data-out operation. The first control information is stored in the second register based on an input to the fourth pad in response to the second timing signal consisting of i cycles, and the second control information is stored in the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles.

Apparatuses and techniques are described for detecting and isolating defective blocks of memory cells in a multi-plane operation such as program or erase. In one aspect, a program operation begins in a multi-plane mode, for one block in each plane. If fewer than all blocks complete programming by the time a trigger number of program loops have been performed, one or more unpassed blocks are programmed further, one at a time, in a single plane mode. If the one or more unpassed blocks do not complete programming when a maximum allowable number of program loops have been performed, they are marked as bad blocks and disabled from further operations. In another aspect, when a trigger number of program loops have been performed, one or more unpassed blocks are subject to a word line leakage detection operation.

A semiconductor memory device includes a first memory cell, a second memory cell above the first memory cell, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, and a control unit that performs an erasing operation on the first and second memory cells. During the erasing operation, the control unit applies a first voltage to a first word line and a second voltage higher than the first voltage to a second word line.

A memory device includes plural non-volatile memory cells and a control circuit. The plural non-volatile memory cells can store data and are arranged in series between a bit line and a source line. The control circuit synchronizes discharge of charges, which are accumulated in a channel formed by the plural non-volatile memory cells, through the bit line and the source line during an erase operation for erasing the data stored in the plural non-volatile memory cells.

Apparatuses and techniques are described for modifying program and erase parameters in a memory device in which memory cells can be operated in a single bit per cell (SLC) mode or a multiple bits per cell mode. In one approach, the stress on a set of memory cells in an SLC mode is reduced during programming and erasing when the number of program-erase cycles for the block in the SLC mode is below a threshold. For example, during programming, the program-verify voltage and program voltages can be reduced to provide a shallower than normal programming. During erasing, the erase-verify voltage can be increased while the erase voltages can be reduced to provide a shallower than normal erase. When the number of program-erase cycles for the block in the SLC mode is above the threshold, the program and erase parameters revert to a default levels.

A semiconductor memory device includes a memory block with string units including a plurality of memory strings of memory cell transistors connected in series. Word lines are connected memory cell transistors in a same row and bit lines are respectively connected to one of the memory strings in each string unit. The bit lines are divided into different groups. A control circuit performs erasing on of the memory cell transistors in the memory block. The control circuit executes the erase verification on only a subset of memory strings in each string unit of the memory block rather than all memory strings.

The memory device includes a plurality of memory cells arranged in a plurality of blocks, which are arranged in at least one plane. A controller is in electrical communication with the plurality of memory cells. The controller is configured to define a multi-block group that includes at least two blocks to be erased. The controller is further configured to simultaneously apply at least one erase pulse to the multi-block group. The controller is further configured to individually and sequentially apply a verify pulse to the blocks. In response to all blocks passing verify, the controller is configured to complete the erase operation. In response to at least one of the blocks not passing verify, the controller is configured to individually and sequentially apply an erase pulse and then a verify pulse to the at least one block that did not pass verify.