An example method includes, performing a first erase verify on a first set of memory cells of a portion of an array of memory cells, performing a second erase verify on a second set of memory cells of the portion of the array, applying a first erase voltage pulse concurrently to each memory cell in the portion of the array if the first set fails the first erase verify and if the second set fails the second erase verify, and applying a second erase voltage pulse concurrently to each memory cell in the portion of the array if the first set passes the first erase verify and if the second set fails the second erase verify. The second erase voltage pulse is different than the first erase voltage pulse.

The present technology relates to an electronic device. According to an embodiment of the present disclosure, a memory device may include a plurality of memory cells connected to each word line, a peripheral circuit configured to perform a program operation on memory cells that are connected to a selected word line, and a control logic configured to control the peripheral circuit to perform the program operation on the memory cells that are connected to the selected word line after performing a pre-program operation that increases a threshold voltage of over-erasure cells, among memory cells that are connected to an adjacent word line, having a threshold voltage of an over-erasure state that is lower than a threshold voltage of an erasure state, to the threshold voltage of the erasure state, wherein the adjacent word line is a word line that is next to the selected word line.

A nonvolatile memory device includes well regions formed in a substrate and arranged in a first direction; a memory block including sub blocks which are formed over the substrate and correspond to the well regions, respectively; and bit lines disposed over the memory block, and extending in the first direction. Each of the sub blocks includes channel layers which are formed in a vertical direction between a corresponding well region and the bit lines, word lines and at least one drain select line and at least one erase prevention line, which are stacked over the substrate along the channel layers. In an erase operation, an erase voltage is applied to a well region corresponding to a selected sub block and an erase preventing voltage is applied to an erase prevention line included in an unselected sub block, the erase voltage may be prevented from being transferred to the unselected sub block.

Provided herein may be a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory cell array including a plurality of memory blocks, each including dummy cells coupled to dummy word lines and normal memory cells coupled to normal word lines, and a peripheral circuit configured to perform an erase operation on a memory block selected from among the plurality of memory blocks. The semiconductor memory device may include control logic configured to control the peripheral circuit so that a pre-program voltage pulse is applied both to the dummy word lines and to the normal word lines, and dummy word line voltages to be applied to the dummy word lines may be respectively controlled while an erase voltage is applied to a common source line of the selected memory block.

Provided herein may be a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory cell array including a plurality of memory blocks, each including dummy cells coupled to dummy word lines and normal memory cells coupled to normal word lines, and a peripheral circuit configured to perform an erase operation on a memory block selected from among the plurality of memory blocks. The semiconductor memory device may include control logic configured to control the peripheral circuit so that a pre-program voltage pulse is applied both to the dummy word lines and to the normal word lines, and dummy word line voltages to be applied to the dummy word lines may be respectively controlled while an erase voltage is applied to a common source line of the selected memory block.

A nonvolatile memory device includes a memory cell array having memory cells, a row decoder circuit connected to the memory cells through word lines, a page buffer circuit connected to the memory cells through bit lines, and a control circuit controlling the row decoder circuit and the page buffer circuit to repeatedly perform an erase loop including an erase and an erase verification with respect to the memory cells. The control circuit is configured to select one of an increase and a decrease of an erase voltage according to a result of the erase verification of a current erase loop and apply the controlled erase voltage to the memory cells in the erase operation of a subsequent erase loop.

The present technology relates to an electronic device. According to an embodiment of the present disclosure, a memory device may include a plurality of memory cells connected to each word line, a peripheral circuit configured to perform a program operation on memory cells that are connected to a selected word line, and a control logic configured to control the peripheral circuit to perform the program operation on the memory cells that are connected to the selected word line after performing a pre-program operation that increases a threshold voltage of over-erasure cells, among memory cells that are connected to an adjacent word line, having a threshold voltage of an over-erasure state that is lower than a threshold voltage of an erasure state, to the threshold voltage of the erasure state, wherein the adjacent word line is a word line that is next to the selected word line.

An erasing method of a nonvolatile semiconductor memory device of the disclosure includes erasing data of a selected memory cell (step S100); immediately applying a programming voltage lower than a programming voltage in a programming time to all control gates of the selected memory cell after the erasing step, thereby performing a week programming (step S110); performing a erasing verification of the selected memory cell (step S120).

A nonvolatile memory device includes a memory cell array having memory cells, a row decoder circuit connected to the memory cells through word lines, a page buffer circuit connected to the memory cells through bit lines, and a control circuit controlling the row decoder circuit and the page buffer circuit to repeatedly perform an erase loop including an erase and an erase verification with respect to the memory cells. The control circuit is configured to select one of an increase and a decrease of an erase voltage according to a result of the erase verification of a current erase loop and apply the controlled erase voltage to the memory cells in the erase operation of a subsequent erase loop.

When a control circuit has received a first erase command, the control circuit controls performing a first pre-write process to allow a first storage device and a second storage device to have threshold voltages, respectively, both increased, and the control circuit thereafter controls performing an erase process to allow the first storage device and the second storage device to have their respective threshold voltages both decreased to be smaller than a prescribed erase verify level. When the control circuit has received a second erase command, the control circuit controls performing a second pre-write process to allow one of the first storage device and the second storage device to have its threshold voltage increased, and control circuit subsequently controls performing the erase process.