A circuit includes a dynamic core data register (DCDR) cell that includes a data register, a shift register and an output circuit to route the output state of the data register or the shift register to an output of the DCDR in response to an output control input. A clock gate having a gate control input controls clocking of the shift register in response to a first scan enable signal. An output control gate controls the output control input of the output circuit and controls which outputs from the data register or the shift register are transferred to the output of the output circuit in response to a second scan enable signal. The first scan enable signal and the second scan enable signal to enable a state transition of the shift register at the output of the DCDR.

A circuit includes a dynamic core data register (DCDR) cell that includes a data register, a shift register and an output circuit to route the output state of the data register or the shift register to an output of the DCDR in response to an output control input. A clock gate having a gate control input controls clocking of the shift register in response to a first scan enable signal. An output control gate controls the output control input of the output circuit and controls which outputs from the data register or the shift register are transferred to the output of the output circuit in response to a second scan enable signal. The first scan enable signal and the second scan enable signal to enable a state transition of the shift register at the output of the DCDR.

A non-volatile computer data storage programming system includes a scan chain modification configured to receive a default model defining a scan chain of an industry standardized device. A controller is in signal communication with the scan chain modification system, and is configured to program an industry standardized device. A non-volatile computer data storage device is configured to receive data from the industry standardized device. The scan chain modification system modifies the default model to generate a new model including a reduced scan chain, and the controller programs the industry standardized device based on the new model such that the industry standardized device is programmed with the reduced scan chain.

A non-volatile computer data storage programming system includes a scan chain modification configured to receive a default model defining a scan chain of an industry standardized device. A controller is in signal communication with the scan chain modification system, and is configured to program an industry standardized device. A non-volatile computer data storage device is configured to receive data from the industry standardized device. The scan chain modification system modifies the default model to generate a new model including a reduced scan chain, and the controller programs the industry standardized device based on the new model such that the industry standardized device is programmed with the reduced scan chain.

There are provided a microcontroller, a memory system having the same, and a method for operating the same. A memory system includes: a semiconductor memory performing a scanning operation on ROM data stored in a microcontroller in a test operation and outputting a result of the scanning operation as a status output signal; and a controller for determining whether an error exists in the ROM data, using the status output signal.

There are provided a microcontroller, a memory system having the same, and a method for operating the same. A memory system includes: a semiconductor memory performing a scanning operation on ROM data stored in a microcontroller in a test operation and outputting a result of the scanning operation as a status output signal; and a controller for determining whether an error exists in the ROM data, using the status output signal.

A memory system includes a memory module and a memory controller. The memory module includes data chips that store data and are assigned to a first sub-channel that generates a first code word or a second sub-channel that generates a second code word, where the first code word and the second code are used to fill a single cache line. The memory controller, upon detection of a hard-fail data chip among the data chips, copies data from the hard-fail data chip to the ECC chip, releases mapping between the hard-fail data chip and corresponding I/O, and defines new mapping between the ECC chip and the corresponding I/O pins.

A memory system includes a memory module and a memory controller. The memory module includes data chips that store data and are assigned to a first sub-channel that generates a first code word or a second sub-channel that generates a second code word, where the first code word and the second code are used to fill a single cache line. The memory controller, upon detection of a hard-fail data chip among the data chips, copies data from the hard-fail data chip to the ECC chip, releases mapping between the hard-fail data chip and corresponding I/O, and defines new mapping between the ECC chip and the corresponding I/O pins.

A test system is provided that includes a memory test circuit, a memory, an input logic circuit, a bypass circuit, an output logic circuit and a register. The register is operated as a pipeline register of the memory test circuit and the output logic circuit. In a first test mode, the memory test circuit transmits a first test signal to the memory such that the memory outputs a memory output test signal to be stored in the register and further transmitted to the memory test circuit or the output logic circuit to perform test.

A 3D semiconductor device, the device including: a first level including single crystal first transistors, and a first metal layer, where the first level is overlaid by a first isolation layer; a second level including second transistors, where the first isolation layer is overlaid by the second level, and where the second level is overlaid by a second isolation layer; a third level including single crystal third transistors, where the second isolation layer is overlaid by the third level, where the third level is overlaid by a third isolation layer, where the third level is bonded to the second isolation layer, where the bonded includes at least one oxide to oxide bond, and where the bonded includes at least one metal to metal bond.