A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.

A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.

A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.

A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.

In a wafer inspection step for testing electrical characteristics of an integrated circuit in a chip region (CP) formed in a wafer, a first probe needle having a relatively small diameter is brought into contact with a first pad for small current and a second probe needle having a relatively large diameter is brought into contact with a second pad for large current. A wiring and a field effect transistor, which are used for forming the integrated circuit, are arranged directly under the first pad to which a relatively small needle pressure of the first probe needle is to be applied. On the other hand, a wiring and a field effect transistor, which are used for forming the integrated circuit, are not arranged directly under the second pad to which a relatively large needle pressure of the second probe needle is to be applied.

A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.

A probe card structure includes an upper guide plate set, a lower guide plate set, a first probe set, a second probe set, and a stiffener. The lower guide plate set includes a first lower guide plate and a second guide plate. The first probe set includes a plurality of first probes each having a first contact end passing through an upper guide plate hole and a second contact end passing through a lower guide plate hole. The second probe set includes a plurality of second probes each having a different length from that of the first probe, and having a third contact end passing through the upper guide plate hole and a fourth contact end passing through the lower guide plate hole. A position of the second lower guide plate determines a length of the fourth contact end projecting from the lower guide plate set.

The present disclosure provides a probe device. The probe device includes a first probe structure and a second probe structure. The first probe structure includes: a first body, a first substrate and a plurality of first probes. The first substrate is disposed on the first body. The first probes electrically connects to the first substrate and protrudes from a surface of the first substrate. The second probe structure includes: a second body, a second substrate and a plurality of second probes. The second body has a plurality of through holes. The second probes electrically connects to the second substrate and protrudes from a surface of the second body through the through holes. The length of the first probe is different from the length of the second probes.