A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

An object is to provide a probe card that enables probes to be arranged at a narrow pitch while causing the probes being inserted through guide holes of a guide plate to be locked to the guide plate so as not to fall out. Two or more probes 200 and a first guide plate 14 including two or more first guide holes 14h through which the probes 200 are inserted, respectively, are provided. The probe 200 is arranged so as to be inclined with respect to the first guide plate 14, and has a locking portion 21 formed by causing a side surface 210 on a first direction d1 side, which is a side surface above the first guide plate 14 and has an acute angle with respect to the first guide plate 14, to protrude, and an offset portion 22 formed by offsetting a side surface 220 on a second direction d2 side, which is a side surface above the first guide plate 14 and has an obtuse angle with respect to the first guide plate 14, to the locking portion side 21. A pair of the probes 220, adjacent to each other, is arranged such that the locking portion 21 of one of the pair opposes the offset portion 22 of the other.

A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

An adjustable supporting device including a circuit board, a first fixing module, an adjusting module, a second fixing module, and a supporting base is configured to support a test circuit module. The supporting base is positioned in a first opening of the circuit board, a second opening of the first fixing module, and a third opening of the adjusting module and abuts against the second fixing module and a carrier of the test circuit module. The supporting base includes a first portion abutting against the second fixing module, a second portion connected to a third portion, the third portion connected to a fourth portion, and the fourth portion abutting against the carrier. The first portion and the second portion adjust the parallelism between the test circuit module and a semiconductor element through contact, thereby adjusting the horizontal flatness of multiple contact points of the test circuit module.

An interface device is provided between a test head and a DUT. In the interface device, each pin electronics IC is coupled to a DUT via an FPC cable.

An interface apparatus is provided between a test head and a device under test includes a frontend module configured of multiple pin electronics integrated circuits in the form of a module.

An electrical connection device includes: a printed circuit board; a probe head holding a plurality of probes, each of the probes having a proximal end portion that is electrically connected to the printed circuit board and a distal end portion that comes into contact with an inspection target object; and a fix base provided below the printed circuit board and partially fixed to an upper surface of the probe head. The fix base and the printed circuit board are relatively movable according to thermal expansion.

The technical solution relates to the field of control of printed circuit (printed circuit boards) assembly and can be used to control the correctness of the soldered connection on the board, as well as in training an untrained user in soldering. There is a need to provide easy-to-learn soldering kits and for studying soldered connections using various electronic components. The technical result achieved with the claimed technical solution, in addition to the implementation of the product and/or the method of its use, is a simplification of the design and ensuring ergonomics and ease of use for an untrained user, such as, for example, but not limited to, a child.