A test adapter for establishing a test connection with a circuit board is provided. The circuit board includes an inter-board connector or a planar contact in close contact with the inter-board connector. The test adapter includes a metal housing having a contact surface in contact with a flat surface of the circuit board, a connection end opposite to the contact surface, and a first cavity having a first opening at the center of the contact surface. The test adapter further comprises a first outer conductor and a first inner conductor arranged in the first cavity, and an insulating medium arranged between the first outer conductor and the first inner conductor. An end of the first outer conductor and an end of the first inner conductor protrude out of the housing via the first opening, the first outer conductor and the first inner conductor both have an elastic deformation capacity along an axial direction to enable the end of the first outer conductor and the end of the first inner conductor both to retract inwards to be in close contact with the planar contact to form a signal-conductive connection between the planar contact and the connection end when the contact surface is in contact with the circuit board.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

The contact probe comprises a barrel 50, an inspection device side terminal 60, a test board side terminal 70, and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60, the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50, and the terminal body includes, in order from a tip end, a first shaft section 71, a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71, and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.

A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.

The present invention relates to a testing device and to a method for testing circuit boards, in particular un-equipped or partially-equipped circuit boards. The testing device is a flying probe with a shuttle or two sub-shuttles, which can displace a circuit board to be tested to a test area in an alternating manner. In addition, the sub-shuttles can be used for commonly holding a large circuit board.

The radio frequency (RF) probe socket is disclosed. The probe socket includes a conductive noise shielding body configured to accommodate the plurality of signal probes to be parallel with one another while exposing opposite ends thereof, and shield noise; upper and lower noise shielding walls configured to be extended from the noise shielding body to some areas between the exposed opposite ends of the plurality of signal probes; and upper and lower holding members configured to be arranged on top and bottom sides of the noise shielding body, support the exposed opposite ends of the plurality of signal probes, and comprise accommodating grooves accommodate the noise shielding walls, respectively. With this, the noise shielding wall extended from the shielding block makes a shield between the signal probe pins passing through the upper and lower holding member, thereby preventing crosstalk between the signal probe pins.

A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

An automatic test equipment (ATE) contactor adapter compatible with at least one test board. The contactor adapter includes a contactor adapter body having a first side and a second side. The contactor adapter body includes: 1) a first set of contact components disposed on the first side in an arrangement to contact conductive pads of the at least one test board; and 2) a second set of contact components disposed on the second side and coupled to the first set of contact points. The contactor adapter also includes an adapter interface disposed on the contactor adapter body. The adapter interface includes a third set of contact components coupled to the second set of contact components. The ATE contactor adapter is configured to convey signals between a device under test (DUT) and the at least one test board via the first, second, and third sets of contact components.