The system for automatic signal measurement includes a device under test, a control circuit, a data processing circuit, and a display device. The device under test includes a test pad area, which has multiple exposed test pads coupled to multiple circuit nodes in the device under test. The control circuit is coupled to the exposed test pads through a clamping fixture. The control circuit receives multiple test signals from the exposed test pads, stores multiple test signals in the memory, and controls a power on/off operation applied to the device under test through the exposed test pads. The data processing circuit is configured to receive the test signals stored in the memory, and determine whether the test signals meet a set of predetermined criteria to generate a verification result. The display device displays a signal waveform of the test signals and the verification result.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

A conduction inspection jig includes a first member having first openings and a flexural strength of 300 MPa or higher, a second member having second openings and positioned above the first member, a support member positioned between the first member and the second member such that the support member is forming a space between the first member and the second member, and a probe that is positioned in one of the first openings in the first member and one of the second openings in the second member such that the probe penetrates through the one of the first openings, the space formed between the first member and the second member, and the one of the second openings and has a first end portion protruding from the first member and a second end portion protruding from the second member on the opposite side with respect to the first end portion.

A circuit test system is provided for testing a circuit of a circuit board. The circuit test system includes a test platform, a pressing plate and a computing device. The test platform includes plural contact elements. Each contact element includes a strain gauge and a pogo pin. During the process of testing the circuit board, a test program of the computing device monitors and reads a pressure value, a downward displacement and an impedance value of the contact element. Moreover, the test program judges whether the function of the contact element is normal according to the pressure value, the downward displacement and the impedance value.

A contact terminal defined by a probe may include a tubular body made of an electrically conductive material and central conductors, each of which is made of an electrically conductive material and has a stick shape. The central conductors and may include stick-shaped bodies inserted into the tubular body. The tubular body may include spring portions, which are defined by helical bodies formed by helical grooves along a circumference thereof and clasping portions, which are fitted onto proximal end portions of the stick-shaped bodies to fit the proximal end portions. The clasping portions may be defined by a circumferential wall of the tubular body and a slit extending from end portions of the helical grooves, which define the spring portions, in an axial direction of the tubular body, at which, portions are separated in a circumferential direction of the tubular body.

A probing apparatus for detection of an electric signal generated by a device-under-test. The probing apparatus includes a rigid support structure having a contact surface for sliding contact with the device-under-test, and a probing instrument to contact the connector for tapping the electric signal. Magnets on the support structure apply attracting force on a mating metal element on the device-under-test such that the probing instrument is aligned to contact the connector, wherein a gap is formed between each magnet and mating metal element when the contact surface touches the device-under-test.

A circuit test system is provided for testing a circuit of a circuit board. The circuit test system includes a test platform, a pressing plate and a computing device. The test platform includes plural contact elements. Each contact element includes a strain gauge and a pogo pin. During the process of testing the circuit board, a test program of the computing device monitors and reads a pressure value, a downward displacement and an impedance value of the contact element. Moreover, the test program judges whether the function of the contact element is normal according to the pressure value, the downward displacement and the impedance value.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

An inspection jig may include: a support plate including a plate-shaped member and having a plurality of through holes extending along a thickness of the support plate; a plurality of probes each having a tubular shape and conductivity, the probes being respectively inserted into the through holes; and an elastomer elastically holding the probes in the through holes. Each of the probes may include a first spring part wound helically in a first direction and configured to expand and contract along an axis of the probe.

A rectangular probe of a probe card device includes a metallic pin and a metallic reinforcing body. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment extending from the first connecting segment in a direction away from the middle segment, and a second contacting segment extending from the second connecting segment in a direction away from the middle segment. The metallic reinforcing body is integrally formed on the middle segment. The Young's modulus of the metallic reinforcing body is larger than that of the metallic pin. The electric conductivity of the metallic pin is larger than that of the metallic reinforcing body. An outside diameter jointly formed by the metallic reinforcing body and the middle segment is larger than an outside diameter of the second connecting segment.