A probe card assembly is provided as follows. A tile fixing substrate is disposed on a printed circuit board. A plurality of ceramic tiles is detachably attached to the tile fixing substrate. Each of the plurality of ceramic tiles comprises a plurality of probes. A plurality of alignment marks is fixed to the tile fixing substrate.

Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

The invention relates to a test card (1) for electrically connecting a test piece (2) to an electrical test device (3), having at least one holding element (4, 5) and having a plurality of electrically conductive contact devices (9) which are guided and supported by the holding element (4, 5), wherein the holding element (4, 5) has a plurality of openings (8) for guiding and/or supporting the contact devices (9) through which openings in each case one of the contact devices (9) extends. According to the invention, the holding element (4, 5) has a three-dimensional structure.

Provided is an electric connecting apparatus 10 including a plurality of probes 20, a probe substrate 16 connected to base end portions 20b of the probes 20, and a probe support body 18, when tip end portions 20a of the probes 20 are pressed by a device under test, preventing the adjacent probes 20 from interfering. The probe support body 18 includes a plate-like guide portion 30 including guide holes through which the probes 20 pass. The guide portion 30 includes an upper guide portion 31, a lower guide portion 32, and a middle guide portion 33. The probes pass through the guide holes of the upper guide portion 31, the middle guide portion 33, and the lower guide portion 32 to be guided toward the device under test. The middle guide portion 33 is provided to be movable in a perpendicular direction X perpendicular to a thickness direction Y.

A probe head includes a first die, a second die, and a plurality of rectangular probes. Each rectangular probe includes a deformable segment arranged between the first and the second dies, a first positioned segment, and a second positioned segment, the latter two of which respectively extend from two opposite ends of the deformable segment and are respectively arranged in a first rectangular wall of the first die and a second rectangular wall of the second die. Each first rectangular wall and the corresponding second rectangular wall have a longitudinal offset and a width offset so as to press the first and second positioned segments of the corresponding rectangular probe, so that the deformable segment of the corresponding rectangular probe is compressed to be in a curved and deformed shape. A ratio of the longitudinal offset to the width offset is within a range of 10 to 1.

A probe holder for securely holding a probe within a certain location includes a base and a limiting block. The base defines a first receiving cavity having a bottom. The bottom of the first receiving cavity defines at least one first through hole penetrating the base. The first through hole is stepped for abutting the probe in one direction. The limiting block is disposed on the base opposite to the first receiving cavity. The limiting block defines at least one second through hole corresponding to the first through hole, the second through hole is also stepped and serves as a second abutting portion against the probe moving in an opposite direction. A test jig using the probe holder is also provided.

The present disclosure relates to a probe head receiver, which includes: a first template, a guide plate and a spacer. The first template has a number of apertures of a first size. The guide plate has a number of apertures of a second size, each of the number of apertures of the first template is aligned with each of the number of apertures of the guide plate. The spacer is between the first template and the guide place. The second size is different from the first size.

In a described example, a device includes: a probe card with a tester side surface and a device side surface opposite the tester side surface; a probe insert having a first surface that is removably affixed to the device side surface of the probe card; and at least one or more probes extending from a second surface of the probe insert that is opposite the first surface of the probe insert.

A probe head for testing a device under test integrated on a semiconductor wafer includes a plurality of contact probes, each having a first end and a second end, and at least one first lower guide and one second lower guide at the first end. The guides are parallel to each other and have a respective plurality of first and second guide holes for slidingly housing the contact probes. At least one third lower guide is substantially parallel to the first lower guide and to the second lower guide and includes a plurality of third guide holes for slidingly housing the contact probes. The guide holes are disposed in a shifted arrangement to eliminate a scrub movement of the first ends of each contact probe of the probe head.