A probe guide plate includes a first silicon substrate, a first recess portion formed in an upper surface of the first silicon substrate, first through-holes formed in the first silicon substrate at a bottom of the first recess portion, a second silicon substrate directly bonded on the first silicon substrate, a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate, and second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes, A notch portion is formed at an upper end portion of an inner wall of each of the first through-holes of the first silicon substrate.

Probe head for wafer-level burn-in test, comprising: a first and a second alignment plates arranged parallel to each other and provided with a plurality of passage holes; at least one spacing element interposed between the first and the second alignment plates and designated for keeping them in a prefixed spaced apart relationship; a plurality of probes housed between the passage holes of the alignment plates; said probes comprising a stem, an input contact and an output contact at the opposite ends of said stem, wherein the input contact passes through the second alignment plate to electrically connect to a corresponding testing channel of a probe card and the output contact comes out of the first alignment plate and is designed to contact a termination of a wafer to be tested; said output contact being retractable into the stem in opposition to a counteracting elastic element.

An electrical connecting device includes probes, and a probe head including a middle guide plate arranged between a top guide plate and a bottom guide plate and closer to the bottom guide plate so as to lead the probes to penetrate therethrough. The top guide plate and the middle guide plate are provided with guide holes through which the probes are inserted at positions shifted between the top guide plate and the middle guide plate so as to lead the probes to be held in a bent state between the top guide plate and the middle guide plate. The probes have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes buckled when tip end parts of the probes are brought into contact with an inspection object.

A connector pin device includes a test socket body made of a flexible insulating material and including a pin mounting part in which mounting holes have been formed and a support part supporting the pin mounting part, sliding contact pins respectively formed in the mounting holes and each including a first contact pin having a first end externally exposed and a second end located within the mounting hole and a second contact pin having a first end externally located on the side opposite the first end of the first contact pin and a second end located within the mounting hole, wherein the first and second ends of the first and the second contact pins are provided to slide and come into contact with each other, and an cavity portion formed in a portion where the second ends of the sliding contact pins in the mounting hole are located.

A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.

A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer.

A round probe of a probe card device includes a metallic pin and insulating latch. The outside diameter of the metallic pin is smaller than or equal to 40 m. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, and a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments in two opposite directions away from the middle segment. The insulating latch is formed on a part of the first contacting segment, and an end portion of the first contacting segment protruding from the insulating latch is defined as a protrusion. A maximum distance between an outer surface of the insulating latch and an adjacent outer surface of the metallic pin is smaller than or equal to the outside diameter of the metallic pin.

A probe card includes a probe board and a needle disposed on the probe board, the needle including a needle tip. The needle tip includes a bottom surface having a long axis and a short axis that crosses the long axis. The needle tip includes a top surface being spaced apart from the bottom surface, wherein the top surface has a long axis and a short axis that crosses the long axis, and wherein the long axis of the bottom surface and the long axis of the top surface extend in different directions. The needle tip includes a side surface connecting the bottom surface with the top surface, wherein the side surface is twisted between the top and bottom surfaces.