Vertical probe arrays having angled guide plates are provided. With this configuration, the probes can be straight conductors (when mechanically undeformed) and the mechanical bias provided by the angled guide plates can ensure the probes have a well-defined deformation when the probe array make contact to the device under test. This allows the use of straight conductors as probes without suffering from probe shorting and mechanical interference caused by straight probes buckling in unpredictable directions when vertically compressed.

An electrical connection device includes: a plurality of probes (10) in which distal end portions contact an inspection object (2) during measurement; and a space transformer (30) including a plurality of connection wirings (33), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes (10) is arranged on a first main surface (301), and a second terminal is exposed to a second main surface (302), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (33), proximal end portions of a plurality of same-potential probes (10) set at a same potential during measurement among the plurality of probes (10).

A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

A probe card device and a self-aligned probe are provided. The self-aligned probe includes a fixing end portion configured to be abutted against a space transformer, a testing end portion configured to detachably abut against a device under test (DUT), a first connection portion connected to the fixing end portion, a second connection portion connected to the testing end portion, and an arced portion that connects the first connection portion and the second connection portion. The fixing end portion and the testing end portion jointly define a reference line passing there-through. The first connection portion has an aligned protrusion, and a maximum distance between the arced portion and the reference line is greater than 75 μm and is less than 150 μm.

A contact probe for a testing head of an apparatus for testing electronic devices comprises a body extending along a longitudinal axis between a first end portion and a second end portion, the second end portion being adapted to contact pads of a device under test. Suitably, the contact probe comprises a first section, which extends along the longitudinal axis from the first end portion and is made of an electrically non-conductive material, and a second section, which extends along the longitudinal axis from the second end portion up to the first section, the second section being electrically conductive and extending over a distance less than 1000 μm.

There is provided a probe device for inspecting a wafer. The probe device includes: an upper camera provided in a wafer alignment unit; a lower camera provided in a stage; a target member provided in any one of the wafer alignment unit and the stage; and a control circuit configured to control each operation of the upper and lower camera. The target member has an end surface on which a target mark is provided, wherein any of the upper and lower camera is configured to capture an image of the target mark. The control circuit is configured to acquire a captured image of the target mark using any of the upper camera and the lower camera; and calculate a correspondence between a specific physical parameter and a value represented in the captured image for a parameter represented in the captured image among physical parameters, based on the acquired captured image.

A probe head adapted to verify the operation of a device to be tested integrated on a semiconductor wafer comprises at least one guide provided with a plurality of guide holes adapted to house a plurality of contact probes. Conveniently, the guide is made of a material suitable for manufacturing integrated circuits and comprises circuit components integrated therein, such guide being an electronically active element of the probe head.

An object is to provide a probe card that enables probes to be arranged at a narrow pitch while causing the probes being inserted through guide holes of a guide plate to be locked to the guide plate so as not to fall out. Two or more probes 200 and a first guide plate 14 including two or more first guide holes 14h through which the probes 200 are inserted, respectively, are provided. The probe 200 is arranged so as to be inclined with respect to the first guide plate 14, and has a locking portion 21 formed by causing a side surface 210 on a first direction dl side, which is a side surface above the first guide plate 14 and has an acute angle with respect to the first guide plate 14, to protrude, and an offset portion 22 formed by offsetting a side surface 220 on a second direction d2 side, which is a side surface above the first guide plate 14 and has an obtuse angle with respect to the first guide plate 14, to the locking portion side 21. A pair of the probes 220, adjacent to each other, is arranged such that the locking portion 21 of one of the pair opposes the offset portion 22 of the other.

An electrical connecting device (1) includes probes (10), and a probe head (20) including a middle guide plate (23) arranged between a top guide plate (21) and a bottom guide plate (22) and closer to the bottom guide plate (22) so as to lead the probes (10) to penetrate therethrough. The top guide plate (21) and the middle guide plate (23) are provided with guide holes through which the probes (10) are inserted at positions shifted between the top guide plate (21) and the middle guide plate (23) so as to lead the probes (10) to be held in a bent state between the top guide plate (21) and the middle guide plate (23). The probes (10) have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes (10) buckled when tip end parts of the probes (10) are brought into contact with an inspection object.