Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.

A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.

A probe card test apparatus including an insulating substrate; a conductive pattern on the insulating substrate; and a plurality of device under test (DUT) units on the conductive pattern, wherein each of the DUT units includes a merged-probe opening, a probe opening, and a detector in parallel, and an isolator surrounding the merged-probe opening, the probe opening, and the detector.

The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

A probe card device and a fan-out probe thereof are provided. The fan-out probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in a straight shape defining a longitudinal direction, and the stroke segment has two end portions. The stroke segment is bendable when the two end portions are respectively applied with forces along two opposite directions. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along a fan-out direction perpendicular to the longitudinal direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

Probe pin arrangements in a vertical-type probe card assembly for an automated test equipment (ATE) are disclosed. In some embodiments, one or more additional conductive regions are provided in between adjacent probe pins. The additional conductive regions may reduce spacing between probe pins connected to adjacent probe card pads, and may in turn reduce or adjust inductance between the two probe cards pads to provide improved signal impedance matching or lower power impedance. In one embodiment, the additional conductive region is a short probe pin. In another embodiment, the additional conductive region is a protrusion on a vertical probe pin.

A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

A relay pogo contact first charged device model test head apparatus for relay-based contact first field induced charged device model testing has a ground plane of conductive material, a coaxial connector whose outer conductor electrically connects to the ground plane, a current-sensing element with one terminal electrically connects to the ground plane and the other terminal electrically connects to the center conductor of the coaxial connector, a switch where the first terminal electrically connects to a center conductor of the coaxial connector, and a probe with one end electrically connected to a second terminal of the switch and the other end exposed to contact external objects.

A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.