Provided is an electrical contactor that is formed from a small number of components that can improve the conductivity in the electrical contactor, while improving the slidability of an elastic member and the electrical contact stability with a contact target. The present disclosure provides an electrical contactor which is formed from a plate-shaped member, the plate-shaped member including: a main body; an upper arm portion; a first tip end portion provided at a tip end of the upper arm portion; a lower arm portion; and a second tip end portion provided at a tip end of the lower arm portion, the electrical contactor including: a first contact portion formed by winding the first tip end portion; a first elastic portion formed by winding the upper arm portion and having a bamboo-shoot-like spring structure; a second contact portion formed by winding the second tip end portion; a second elastic portion formed by winding the lower arm portion and having a bamboo-shoot-like spring structure; and a coupling portion that couples the first elastic portion and the second elastic portion to enable elasticity of each of the first elastic portion and the second elastic portion by winding the main body, in which each or either of a tip end surface of the first contact portion that contacts the first contact target and a tip end surface of the second contact portion that contacts the second contact target is an inclined surface.

A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.

The present invention provides a device for testing a chip, wherein the device includes a testing board and an interposer. The testing board has a plurality of pads for providing a plurality of test signals. The interposer board includes a plurality of passive components, and at least one of the passive components is coupled between a supply voltage and a ground voltage, and the supply voltage and the ground voltage are received from a power pad and a ground pad of the plurality of pads of the testing board, respectively; wherein the chip is positioned in the device, the chip receives the test signals including the supply voltage and the ground voltage from the power pad and the ground pad of the testing board, respectively.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

An inspection jig includes a first board, a probe unit including a probe, a second board located in parallel with the first board and electrically connected to the probe, an electrical connection portion electrically connecting the first board and the second board, and a board holding portion holding the second board in parallel with the first board in the thickness direction and holding the probe unit. The board holding portion includes a probe-side holding plate located on the probe unit side of the second board and a holding plate support portion that positions the probe-side holding plate at a position where the probe-side holding plate is in parallel with the first board in the thickness direction. The board holding portion holds the second board so that the first board and the second board are electrically connected via the electrical connection portion being sandwiched between the first board and second board.

Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.

A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.

Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.

A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.