The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test apparatus with each other. Conduction units that are arranged at positions corresponding to the terminal of the blood test device and show conductivity in a thickness direction have: conduction units that are arranged in such a manner that multiple conductive particles are arranged in the thickness direction in an elastic insulating material; and an insulating support unit that supports and insulates each of the conduction units. The conductive particles are provided with through-holes bored through one surface and another surface other than the one surface, and the through-holes are filled with the elastic insulating material.

A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.

In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device.

A signal input/output circuit is provided with an input line, a common output line, a plurality of individual output lines, relay switches, and resistor elements. The common output line is connected to a comparator. The common output line synthesizes response signals transmitted from a plurality of devices under test (DUT), and transmits a synthesized response signal generated by synthesizing, into one signal, the response signals outputted from the respective DUTs. In response to a test signal transmitted from a pattern generator, the comparator compares the synthesized response signal with a threshold value.

High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.

A detection substrate, a preparation method thereof, a detection device and a detection method are provided. A detection substrate includes a base substrate, wherein the base substrate includes multiple through holes, and electrode columns are embedded in the multiple through holes; the base substrate comprises a detection region and a bonding pad region, the detection region includes a driving circuit, and the bonding pad region is provided with bonding pads; and the bonding pads are connected with the electrode columns through the driving circuit.

The present disclosure discloses a probe module, comprising: a body, a floating plate located at the bottom of the body and a probe assembly located on the side of the body which is far away from the floating plate. The probe assembly includes a cover plate, a mould core comprising pin grooves and blade pins each limited and fixed in the pin groove by a limiting member. The floating plate comprises pin holes, and the floating plate is configured to be floatable relative to the body in an extension direction of the blade pin and electrical contact terminals of the blade pins may be inserted into the pin holes from the surface of the floating plate close to the body and protrude from the surface of the floating plate which is far away from the body.

A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

An electrical connection device includes: a plurality of probes (10) in which distal end portions contact an inspection object (2) during measurement; and a space transformer (30) including a plurality of connection wirings (33), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes (10) is arranged on a first main surface (301), and a second terminal is exposed to a second main surface (302), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (33), proximal end portions of a plurality of same-potential probes (10) set at a same potential during measurement among the plurality of probes (10).

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.