A test coverage rate improvement system for pins of tested circuit board and a method thereof are disclosed. In the system, partial pins of a circuit board connector in a tested circuit board are not electrically connected to the boundary scan chip, test pins of the test pin board are pressed with the partial pins by a fixture of a boundary scan interconnect testing workstation to electrically connect the test pins to the partial pins. A test access port controller receives a detection signal for detecting the partial pins, which are not electrically connected to the boundary scan chip, of the circuit board connector through the test pin board from the test adapter card, and determines whether conduction is formed based on the detection signal, thereby achieving the technical effect of improving a test coverage rate for the pins of the tested circuit board.

The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.

The present invention provides a reliable method and arrangement for boundary scan testing and debugging newly manufactured multi-chip modules (MCMs) made to identical design specifications with no Known Good Die therein. Advantageously, a first and a second MCM are temporarily linked in tandem for boundary scan testing through a motherboard and daisy-chaining their internal dice, and interlinking the corresponding boundary scan cells of the identical dice of the first and second MCM to (1) run self-test on individual MCMs and mutual test on the MCMs connected in tandem in order to generate an extended Truth Table that includes responses from an array of combined netlists of the first and second MCMs, and (2) to diagnose mismatched bits in the extended Truth Table using a Boundary Scan Diagnostics software so as to identify defects in the first and second MCMs.

A combinational circuit block has input pins configured to receive input digital signals and output pins configured to provide output digital signals as a function of the input digital signals received. A test input pin receives a test input signal. A test output pin provides a test output signal as a function of the test input signal received. A set of scan registers are selectively coupled to either the combinational circuit block or to one another so as to form a scan chain of scan registers serially coupled between the test input pin and the test output pin. The scan registers in the set of scan registers are clocked by a clock signal. At least one input register is coupled between the test input pin and a first scan register of the scan chain. The at least one input register is clocked by an inverted replica of the clock signal.

A semiconductor device includes a plurality of first micro-bumps suitable for transferring normal signals; a plurality of a second micro-bumps suitable for transferring test signals; and a test circuit including a plurality of scan cells respectively corresponding to the first and second micro-bumps. The test circuit is suitable for applying signals stored in the respective scan cells to the first and second micro-bumps, feeding back the applied signals from the first and second micro-bumps to the respective scan cells, and sequentially outputting the signals stored in the scan cells to a test output pad.

A system is provided, comprising: a plurality of flip-flops that are configured to receive a reset signal, each of the plurality of flip-flops having a respective output port, and each of the plurality of flip-flops being configured to assume a respective default state when the reset signal is set to a predetermined value; and a reset monitor circuit that is coupled to the respective output port of each of the plurality of flip-flops, the reset monitor circuit being configured to generate a status signal indicating whether each of the flip-flops has assumed the flip-flop's respective default state after the reset signal is set to the predetermined value, wherein assuming a respective default state by each of the plurality of flip-flops results in a predetermined bit string being stored in the plurality of flip-flops.

A circuit includes a test data input (TDI) pin receiving a test data input signal, a test data out (TDO) pin outputting a test data output signal, and debugging test access port (TAP) having a test data input coupled to the TDI pin and a bypass register having an input coupled to the test data input of the debugging TAP. A multiplexer has inputs coupled to the TDI pin and the debugging TAP. A testing TAP has a test data input coupled to the output of the multiplexer, and a data register having an input coupled to the test data input of the testing TAP. The multiplexer switches so the test data input signal is selectively coupled to the input of the data register of the testing TAP so the output of the debugging TAP is selectively coupled to the input of the data register of the testing TAP.

There is provided a semiconductor apparatus including a memory controller; a CPU; a high-speed communication controller; a memory operation terminal group that includes a plurality of memory operation terminals for inputting a first signal propagating between an external memory group and the memory controller; a high-speed communication terminal group that includes a plurality of high-speed communication terminals for inputting a second signal to the high-speed communication controller; an inspection terminal group that includes a plurality of inspection terminals for acquiring information from the CPU and performing debugging; and a terminal mounting surface at which the memory operation terminal group, the high-speed communication terminal group, and the inspection terminal group are provided, in which at the terminal mounting surface, a first inspection terminal among the plurality of inspection terminals is located between the memory operation terminal group and the high-speed communication terminal group.

A system is provided, comprising: a plurality of flip-flops that are configured to receive a reset signal, each of the plurality of flip-flops having a respective output port, and each of the plurality of flip-flops being configured to assume a respective default state when the reset signal is set to a predetermined value; and a reset monitor circuit that is coupled to the respective output port of each of the plurality of flip-flops, the reset monitor circuit being configured to generate a status signal indicating whether each of the flip-flops has assumed the flip-flop's respective default state after the reset signal is set to the predetermined value, wherein assuming a respective default state by each of the plurality of flip-flops results in a predetermined bit string being stored in the plurality of flip-flops.

Examples described herein provide a computer-implemented method that includes initiating a logic built-in self-test (LBIST) of a device under test (DUT). The method further includes performing latch state counting using a multiple input signature register (MISR) of the DUT, the performing responsive to the MISR being in a counter mode. The method further includes performing a latch transition counting of latches of the DUT using the MISR of the DUT and a storage latch, the performing responsive to the MISR being in the counter mode. The method further includes performing a latch count comparison by comparing an output of the MISR responsive to the MISR being in the counter mode to an output of a count compare register, the output of the count compare register representing a desired MISR state.