Various aspects of the disclosed technology relate to using capture-per-cycle test points to reduce test application time. A scan-based testing system includes a plurality of regular scan chains and one or more capture-per-cycle scan chains on which scan cells capture and compact test responses at predetermined observation points per shift clock cycle.

The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.

Control events may be signaled to a target system having a plurality of components coupled to a scan path by using the clock and data signals of the scan path. While the clock signal is held a high logic level, two or more edge transitions are detected on the data signal. The number of edge transitions on the data signal is counted while the clock signal is held at the high logic state. A control event is determined based on the counted number of edge transitions on the data signal after the clock signal transitions to the low logic state.

A system comprises a plurality of components, scan chain selection logic coupled to the components, and override selection logic coupled to the scan chain selection logic. The scan chain selection logic selects various of the components to be members of a scan chain under the direction of a host computer. The override selection logic detects a change in the scan chain and, as a result, blocks the entire scan chain from progressing.

A Scan test in a single-wire bus circuit is described in the present disclosure. The single-wire bus circuit has only one external pin for connecting to a single-wire bus. Given that multiple physical pins are required to carry out the Scan test, the single-wire bus circuit must provide additional pins required by the Scan test. In embodiments disclosed herein, the single-wire bus circuit includes a communication circuit under test, and a driver circuit coupled to the communication circuit via multiple internal pins. The driver circuit uses a subset of the internal pins as input pins and another subset of the internal pins as output pins to carry out the Scan test in the communication circuit. As a result, it is possible to perform the Scan test without adding additional external pins to the single-wire bus circuit, thus helping to reduce complexity and footprint of the single-wire bus circuit.

An aspect relates to an integrated circuit (IC), including: a data path; a logic gate including a first input coupled to the data path, and a second input configured to receive a second input configured to receive a test data register (TDR) signal; and a first flip-flop including a data input coupled to an output of the logic gate. Another aspect relates to integrated circuit (IC), including: a first logic gate including a first input configured to receive a test data register (TDR) signal; a first flip-flop including a data input (D) coupled to an output of the first logic gate, and a data output (Q) coupled to a second input of the first logic gate; a first data path; and a second logic gate including a first input coupled to the data output of the first flip-flop and a second input coupled to the first data path.

A system comprises a plurality of components, scan chain selection logic coupled to the components, and override selection logic coupled to the scan chain selection logic. The scan chain selection logic selects various of the components to be members of a scan chain under the direction of a host computer. The override selection logic detects a change in the scan chain and, as a result, blocks the entire scan chain from progressing.

In one example, an integrated circuit comprises a die. The die has a first surface and a second surface, the second surface opposite to the first surface. The die also includes: a first contact on the first surface and a second contact on the second surface; a through silicon via having a first end and a second end, the first end coupled to the first contact and the second end coupled to the second contact; and a scan cell having a control input, a response input, and a stimulus output, the response input coupled to the first end and the stimulus output coupled to the second end.

Topology discovery of a target system having a plurality of components coupled with a scan topology may be performed by driving a low logic value on the data input signal and a data output signal of the scan topology. An input data value and an output data value for each of the plurality of components is sampled and recorded. A low logic value is then scanned through the scan path and recorded at each component. The scan topology may be determined based on the recorded data values and the recorded scan values.

The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.