Monolithic three-dimensional integration can achieve higher device density compared to 3D integration using through-silicon vias. A test solution for M3D integrated circuits (ICs) is based on dedicated test layers inserted between functional layers. A structure includes a first functional layer having first functional components of the IC with first test scan chains and a second functional layer having second functional components of the IC with second test scan chains. A dedicated test layer is located between the first functional layer and the second functional layer. The test layer includes an interface register controlling signals from a testing module to one of the first test scan chains and the second test scan chains, and an instruction register connected to the interface register. The instruction register processes testing instructions from the testing module. Inter-layer vias connect the first functional components, the second functional components, and the testing module through the test layer.

A device test architecture and interface is provided to enable efficient testing embedded cores within devices. The test architecture interfaces to standard IEEE 1500 core test wrappers and provides high test data bandwidth to the wrappers from an external tester. The test architecture includes compare circuits that allow for comparison of test response data to be performed within the device. The test architecture further includes a memory for storing the results of the test response comparisons. The test architecture includes a programmable test controller to allow for various test control operations by simply inputting an instruction to the programmable test controller from the external tester. The test architecture includes a selector circuit for selecting a core for testing. Additional features and embodiments of the device test architectures are also disclosed.

A circuit is for coupling test access port (TAP) signals to a Joint Test Action Group (JTAG) interface in an integrated circuit package. An nTRST pin receives a test reset signal, a TMS pin receives a test mode select signal, a testing test access port (TAP) has a test reset signal input and a test mode select signal input, and a debuging test access port (TAP) has a test reset signal input coupled to the nTRST pin and a test mode select signal input coupled to the TMS pin. An inverter has an input coupled to the nTRST pin and an output coupled to the test reset signal input of the testing TAP, and an AND gate has a first input coupled to the output of the inverter, a second input coupled to the TMS pin, and an output coupled to the test mode select input of the testing TAP.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

A register array includes a plurality of groups of latches. Each of the groups of latches includes a first latch, a second latch, and a test latch connected to the first latch and the second latch. During functional operation the first latch and the second latch process data, in response to the same read/write clock signal supplied simultaneously to the first read/write clock input and the second read/write clock input. During test operation a skewed test clock signal of an original test clock signal is supplied at different timings to the first latch, the second latch, and the test latch, and a single scan signal is input to the first latch. The single scan signal cascades from the first latch through the test latch to the second latch, and is output by the second latch, within a single cycle of the original test clock signal.

Embodiments relate to systems and methods for defect detection and localization in semiconductor chips. In an embodiment, a plurality of registers is arranged in a semiconductor chip. The particular number of registers can vary according to a desired level of localization, and the plurality of registers are geometrically distributed such that defect detection and localization over the entire chip area or a desired chip area, such as a central active region, is achieved in embodiments. In operation, a defect detection and localization routine can be run in parallel with other normal chip functions during a power-up or other phase. In embodiments, the registers can be multi-functional in that they can be used for other operational functions of the chip when not used for defect detection and localization, and vice-versa. Embodiments thereby provide fast, localized defect detection.

A method, executed by a computer, includes receiving a scan chain design comprising a plurality of parallel scan chains, each parallel scan chain comprising one or more serially connected single-bit registers, each parallel scan chain having a scan chain length. The plurality of parallel scan chains are interspersed with a plurality of stumpmuxes that enable access to the plurality of parallel scan chains and segment each parallel scan chain into a plurality of scan chain segments. The method further includes conducting a determining operation comprising determining a parallel scan chain having a longest scan chain length, and conducting a swapping operation comprising swapping scan chain segments attached to a selected stumpmux to reduce the longest scan chain length and produce an updated scan chain design. A computer system and computer product corresponding to the above method are also disclosed herein.

A number of embodiments include an apparatus comprising a memory array including a first memory bank and a second memory bank and a serializer/de-serializer coupled to the first memory bank and the second memory bank. The serializer/de-serializer may be configured to receive a scan vector from the first memory bank, send the scan vector to a device under test, receive scan test responses from the device under test, and send the scan test responses to the second memory bank. Scan control logic may be coupled to the serializer/de-serializer and the device under test. The scan control logic may be configured to control operation of the serializer/de-serializer and send a scan chain control signal to the device under test, wherein the scan chain control signal is to initiate performance of a scan chain operation using the scan vector.

A method of testing an IC chip having a plurality of programmable blocks and at least one memory. The method includes configuring a first programmable block of the plurality of programmable blocks with scan test logic for carrying out a scan test on other ones of the plurality of programmable blocks. The method further includes generating scan patterns and expected results for the scan test outside the IC chip. The generated scan patterns and expected results are loaded into the memory. The scan patterns from the memory are injected into the other programmable blocks. An output response of the other programmable blocks to the scan patterns is obtained. The output response is compared with the expected results by the scan test logic within the first programmable block. A scan test result based on the comparison between the output response and the expected results is provided.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.