There is provided an optical module, which includes a substrate; one or more optical devices disposed on the substrate; an integrated circuit (IC) device disposed on the substrate for driving the one or more optical devices; one or more optical fibers in optical communications with the one or more optical devices, respectively; an optical bench that attaches to the substrate and concentrates a direction of the light transmitted between the one or more optical devices and the one or more optical fibers; and a cover that attaches to the optical bench with the one or more optical fibers fixed therebetween. The optical bench changes a direction of the concentrated light.

An optical fiber splicing tray is disclosed. The optical fiber splicing tray may include: an optical fiber splicing tray body; and a marker detachably connected to the optical fiber splicing tray body, where the marker is arranged at a position facilitating observation and identification of the marker when a plurality of optical fiber splicing trays are stacked.

An image sensor assembly and a method for assembling. The assembly includes: a ceramic package; at least one wall raised from the ceramic package, one of the walls for dividing a first surface region and a second surface region of the ceramic package; a frame supported by the ceramic package; a first set of fiducial markers and a second set of fiducial markers visible on the frame; a first die for placement onto the first surface region, the first die including an image sensor and respective fiducial markers for alignment with the first set of fiducial markers; a second die for placement onto the second surface region, the second die including an image sensor and respective fiducial markers for alignment with the second set of fiducial markers; and at least one optical filter each associated with one of the dice and supported by at least one of the walls.

A photoelectric conversion element includes a substrate including a lens-shaped convex portion and an annular concave portion surrounding the lens-shaped convex portion on a first main surface; a photoelectric conversion layer, positioned on an optical path of light passing through the lens-shaped convex portion, on a second main surface side of the substrate; and a pattern disposed on an outer peripheral side of the annular concave portion on the first main surface and disposed to interpose the lens-shaped convex portion from a first direction and a second direction intersecting the first direction.

The invention relates to a laser projection arrangement. The arrangement includes a sub-mount carrier with a main surface and at least one edge-emitting laser arranged on the sub-mount. The at least one edge-emitting laser is facing the sub-mount and includes at least one laser facet that is located at a predefined distance from the main surface of the sub-mount. A planar light circuit with at least one light guide has an inlet and is arranged on the sub-mount such that the at least one light guide and the inlet is located at the predefined distance from the main surface of the sub-mount facing the at least one laser facet.

The present invention relates of a photonic integrated and a method of fabricating a photonic integrated chip, PIC, configured for alignment and attachment of a laser diode in a predetermined position in which light from the laser diode is aligned with an input of the PIC; wherein the photonic chip comprises an asymmetric alignment assembly for receiving and aligning the laser diode in the predetermined position; and wherein the input comprises a coupler for receiving a laser beam from the laser diode in use.

A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.

Disclosed herein is an optical system, comprising a first optical component, featuring a first waveguide and a recess which passes at least partially through the first optical component from a front side to a back side, a second optical component, arranged in the recess of the first optical component, and a second waveguide optically coupled with the first waveguide, and a carrier substrate. The first optical component including a first marking set with a defined position/orientation relative to the first waveguide, the second optical component including a second marking set with a defined position/orientation relative to the second waveguide, and based on a relative position/orientation of the first and second marking sets, determine whether the first and the second optical components are aligned in a reference plane that is parallel to a surface of the carrier substrate, such that the first and the second waveguide are optically coupled.

A configuration of both optical and electronic integrated circuits is formed upon a single substrate in a side-by-side arrangement, with minimal interposing elements required to direct the flow of electronic signals from one IC to another. The various sets of optical connections (typically, fiber arrays that are connected to components beyond the interconnect) are disposed around the outer periphery of the interconnect in a manner that allows for efficient access. Oriented with the substrate as top layer in stack, a heatsink may be coupled directly to exposed substrate surface and provide an efficient path for heat transfer away from the interconnection assembly.

A carrier laser device assembly is provided in which a visible region of a laser that includes an output portion and/or output portion of a waveguide of the laser is visible to an imaging system when the laser is attached to a carrier. The laser may be burned-in and/or tested prior to attachment to a photonic integrated circuit. The output portion and/or output portion of waveguide may be aligned with a corresponding input portion and/or input portion of a waveguide of the PIC as the laser assembly is being attached to the PIC via imaging of the visible portion by the imaging system.