The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

A device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure comprising electrically pumped optical source supporting a first optical mode. The second element comprises a passive waveguide structure supporting a second optical mode in at least part of the second element. The third element, at least partly butt-coupled to the first element, comprises an intermediate waveguide structure supporting intermediate optical modes. At least part of the second element supports at least one optical mode that interacts with rare-earth dopants. A tapered waveguide structure in at least one of the second and the third elements facilitates efficient adiabatic transformation between the second optical mode and at least one of the intermediate optical modes. No adiabatic transformation occurs between any of the intermediate optical modes and the first optical mode. Mutual alignments of the elements are defined using lithographic alignment marks.

A device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure supporting a first optical mode and at least one of the modal gain control structures. The second element comprises a passive waveguide structure supporting a second optical mode. The third element, at least partly butt-coupled to the first element, comprises an intermediate waveguide structure supporting intermediate optical modes. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitate efficient adiabatic transformation between the second optical mode and one of the intermediate optical modes. No adiabatic transformation occurs between any of the intermediate optical modes and the first optical mode. Mutual alignments of the first, second and third elements are defined using lithographic alignment marks.

An opto-electric hybrid board capable of precisely mounting an optical element in a mirror position of an optical waveguide, there is provided an opto-electric hybrid board including: an electric circuit board having first and second surfaces and including terminals for mounting an optical element on the first surface; and an optical waveguide provided on the second surface of the electric circuit board and including a mirror for optical coupling to the optical element, wherein an alignment mark for identifying the position of an exit surface of light exiting via the mirror of the optical waveguide is formed on the first surface of the electric circuit board.

A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.

Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.

An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.

A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.