In one aspect, a light module is disclosed, which includes a housing providing a hollow chamber extending from a proximal end to a distal end, and a lens positioned in the hollow chamber, where the lens has a lens body comprising an input surface for receiving light from a light source and an output surface through which light exits the lens body, said lens further comprising a collar at least partially encircling said lens body. The light module further includes at least one shoulder on which the lens collar can be seated for positioning the lens within the housing. A light source, e.g., an LED, is coupled to the hollow chamber, e.g., at its proximal end, for providing light to the lens. In some embodiments, an optical window is disposed in the hollow chamber and is optically coupled to the output surface of the lens such that the light exiting the lens passes through the optical window before exiting the light module. In some embodiments, the shoulder can be formed as part of the housing. In other embodiments, the shoulder can be provided by a sleeve disposed in the module's housing.

A coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip are disclosed. The device comprises a transfer mold which includes a substrate, first protrusions, and second protrusions. The first protrusions are provided with through holes and are used for being clamped into first recesses in the laser chip; and the second protrusions are used for being clamped into second recesses in the silicon-based optoelectronic chip. The coupling alignment is achieved by etching the first recesses in the laser chip, etching the second recesses in the silicon-based optoelectronic chip, etching the first protrusions, the second protrusions, and the through holes in the transfer mold. A flip-chip suction nozzle is connected with the transfer mold, which is in alignment with the laser chip, and picks up the laser chip by means of the through holes. Then, the laser chip is assembled on the silicon-based optoelectronic chip by aligning and contacting the transfer mold with the silicon-based optoelectronic chip. The method is of high precision, high efficiency, low costs, and can achieve large-scale and mass production.

Provided are a subminiature optical transmission module and a method for manufacturing same. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.

A micro-optical connector holder with an integrated mating system for an optical assembly, typically on a modem PCBA. The integrated mating system is used to hold the micro-optical connectors together during assembly and to apply constant pressure keeping the connectors fully mated. The invention also uses a spring-pin mechanism to keep the holder lid and connectors in place without the use of screws or glue to make assembly easier. The integrated mating system allows the micro-optical connectors to be easily installed and uninstalled for manufacturing and testing purposes. The connector plugs and connector receptacles are aligned and secured by the integrated connector holder.

A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.

Alignment aid structures and the method of formation of these structures on an interposer comprised of a planar waveguide layer and a base structure, facilitate the alignment of the optical axes of optical and optoelectrical devices formed from and mounted to the interposer. Alignment aids formed from a common hard mask on the planar waveguide layer of the interposer structure include vertical and lateral alignment structures and fiducials. Optical losses for signals propagating in interposer-based photonic integrated circuits are reduced with effective alignment structures and methods.

A multi-channel optical transmitter or transceiver includes transmitter optical subassembly (TOSA) modules optically coupled to and directly aligned with mux input ports of an optical multiplexer without using optical fibers. The optical multiplexer may include an arrayed waveguide grating (AWG) or a reversed planar lightwave circuit (PLC) splitter and may be located in a multiplexer housing having at least one side wall with input apertures aligned with the mux input ports. The TOSA modules may include a base supporting at least a laser, laser driving circuitry, and a lens for focusing the light output from the laser. Z-rings may be used to facilitate alignment and to mount the TOSA bases to the side wall of the multiplexer housing, for example, by laser welding.

Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.

An alignment optical circuit includes: a plurality of grating couplers that are formed on a substrate and arranged on a line; a plurality of optical waveguides that are connected to the plurality of grating couplers, respectively. Further, the alignment optical circuit includes an optical sensor that is formed on the substrate and measures optical intensity at a first light-receiving spot and a second light-receiving spot on a line along an arrangement direction of the plurality of grating couplers.