Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber.

An optical device includes a substrate. The substrate includes a first optical waveguide component having a first optical waveguide, a pair of first projections in which a gap between side faces thereof varies in a direction along an optical axis of the first optical waveguide, and a first pattern. The optical device includes a second optical waveguide component. The second optical waveguide component includes a second optical waveguide, at least one pair of second projections, and a second pattern. The second pattern and the first pattern are soldered to each other and side faces of the at least one pair of second projections are in contact with the side faces of the pair of first projections, respectively.

Fiber Bragg grating interrogation and sensing used for strain and temperature measurements. A simple, broadband light source is used to interrogate one or more fiber Bragg grating (FBG). Specifically, a packaged LED is coupled to fiber, the light therefrom is reflected off a uniform FBG. The reflected light is subsequently analyzed using a filter and a plurality of Si photodetectors. In particular, the filter is a chirped FBG or an optically coated filter, in accordance with some embodiments. Measurement analysis is performed by ratio of intensities at the plurality of detectors, at least in part.

There is provided a method for fabricating an optical printed circuit board. The method includes preparing a first printed circuit board portion with an array of optical fibers attached thereon, assembling an optical fiber connector with the first printed circuit board portion such that the optical fiber connector is arranged at ends of the array of optical fibers, and attaching one or more second printed circuit board portions to the first printed circuit board portion to form an optical printed circuit board with the optical fiber connector embedded therein. The optical fiber connector includes an engagement mechanism arranged for engagement with an external optical device.

Embodiments herein describe an optical array unit configured to couple a photonic die with a plurality of optical fibers. The optical array unit includes alignment features which engage with alignment features on a corresponding photonic die. The engaged alignment features reduce the need for active alignment while also reducing the complexities of traditional passive alignment features.

A connection structure for optical waveguide chips includes a silica-based PLC in which grooves are formed, spacer steel balls fitted in the grooves, and silica-based PLCs in which grooves into which the spacer steel balls to be fitted are formed, the silica-based PLCs being mounted on the silica-based PLC by being supported by the spacer steel balls. A conductor wire formed in the silica-based PLC and a conductor wire formed in the silica-based PLC are electrically connected to each other by a conductor film formed in the groove, the spacer steel balls and a conductor film formed in the groove.

A hybrid integrated optoelectronic chip including an optoelectronic chip and a silicon photonic chip, a material of the optoelectronic chip being different from a material of the silicon photonic chip. The optoelectronic chip includes at least one first waveguide. The silicon photonic chip includes at least one second waveguide and an installation recess. The optoelectronic chip is installed in the installation recess, and the first waveguide is optically connected to the second waveguide.

Optical apparatus and methods of manufacture thereof An optical apparatus (20) for evanescently coupling an optical signal across an (interface (30) is described. The optical apparatus (20) comprises a first substrate (22) and a second substrate (24). The optical signal is evanescently coupled between a first waveguide (26) formed by laser inscription of the first substrate (22) and a second waveguide (28) of the second substrate (22). The first waveguide (26) comprises a curved section (34) configured to provide evanescent coupling of the optical signal between the first and second waveguides (26, 28) via the interface (30).

In one aspect, a light module is disclosed, which includes a housing providing a hollow chamber extending from a proximal end to a distal end, and a lens positioned in the hollow chamber, where the lens has a lens body comprising an input surface for receiving light from a light source and an output surface through which light exits the lens body, said lens further comprising a collar at least partially encircling said lens body. The light module further includes at least one shoulder on which the lens collar can be seated for positioning the lens within the housing. A light source, e.g., an LED, is coupled to the hollow chamber, e.g., at its proximal end, for providing light to the lens.

An apparatus includes a first and second VCSEL, each with an integrated lens. The VCSELs emit a first light beam having first optical modes at first wavelengths and a second light beam having second optical modes at second wavelengths. The apparatus also has an optical block with a first and second surface, a mirror coupled to the second surface, and a wavelength-selective filter coupled to the first surface. The first integrated lens mode matches the first beam to the optical block, and the second integrated lens mode matches the second beam to the optical block such that the first beam and second beam each have substantially a beam waist with a beam waist dimension at the first and second input region, respectively. An exit beam that includes light from the first beam and the second beam is output from the second surface of the optical block.