Methods and systems for split voltage domain receiver circuits are disclosed and may comprise amplifying received electrical signals in a plurality of partial voltage domains, and combining the amplified received signals, utilizing a stacked cascode amplifier for each partial voltage domain, into a single differential signal in a single voltage domain. The stacked cascode amplifiers may comprise a feedback loop having a comparator which controls a current source in each domain. The signals may be received from a photodiode, which may be integrated in the integrated circuit. The amplified signals may be combined via stacked common source or common emitter amplifiers. The received signals via may be amplified by stacked inverters. The amplified received signals may be AC or DC coupled prior to the combining. The received electrical signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked and may be controlled by feedback loops.

A light-emitting device comprises: a substrate that holds one end of connection terminals and on which is mounted an electronic component; a light-emitting element that is mounted on one face of the substrate; a support member on which the substrate is mounted; and a cover section that positionally locates and holds the substrate, by mounting on the support member in a condition abutting one face of the substrate. The cover section has a cover section body that covers one face of the substrate; on the cover section body, a light guide is provided, through which passes the light that is emitted from the light emitting element, in a condition in which movement thereof is restricted along directions on either side of the substrate.

Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including an optical package or co-packaged optics package comprising a lid. In an embodiment, an optical package can include a first substrate, a first circuit coupled to the first substrate and configured to transmit or receive an electrical signal, a second circuit coupled to the first substrate and configured to transmit or receive an optical signal, and a lid configured to couple to the first substrate and configured to cover at least a portion of the first circuit or the second circuit.

A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.

A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.

To assemble a donor part to a receiver part, place the receiver part on a stage; provide at least one compliant elastomeric member associated with at least one of the stage and a vacuum element; and use the vacuum element to lift the donor part and assemble it to the receiver part on the stage. Misalignment of the receiver part and the donor part is tolerated by the at least one compliant elastomeric member.