Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS

A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

An optical transducer for endoscope includes an optical element, an optical fiber, and a fiber holding member including a first holding member including a first principal surface and a second principal surface and a second holding member in which a third principal surface is disposed to face the second principal surface, a first through-hole into which the optical fiber is inserted, being formed in the first holding member, the optical element being mounted on a fourth principal surface. A trench connected to the first through-hole and including openings respectively on opposed two side surfaces is formed on the second principal surface. Only a part of a distal end portion of the optical fiber is observable from the openings of the trench.

In order to simplify mounting and cabling of optoelectronic plug connectors (3, 3′) and—equipped therewith—subdistribution units (6) and subdistribution systems, the use of special module housings (100) is proposed. The latter can accommodate a plurality of, in particular eight, identical and/or different optoelectronic transducers (2, 2′) and are installed in the plug connectors (3, 3′) between the electrical plug contacts (311) and the multi-core optical cables (58), i.e. the cores (51) thereof. Susceptibility to errors is considerably improved as a result and mounting is significantly simplified as a result of the improved clarity.

A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

An optical device includes: a base having first and second ends in first and second directions, respectively, and extends in the first direction; an optical module having a head adjacent to the base and is positioned close to the second end and a neck protruding from the head and is thinner than the head; a substrate attached on the base arranged with the head; and a pressing member having a first fixing portion fixed to the base, a second fixing portion fixed to the base, a first extension portion extending from the first fixing portion, a second extension portion extending from the second fixing portion, and a pressing portion provided in at least one of the first and the second extension portions and presses the head against the base.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.

An optical module includes a circuit board, an optical emission chip array, an optical receiver chip array, an optical fiber array, and a lens assembly. The lens assembly includes a body with a step provided at a bottom portion thereof, an emission lenses array, an optical fiber lenses array, and a receiving lenses array. The emission lenses array and the receiving lenses array are respectively arranged on two step surfaces of the step, such that focal points thereof respectively fall on an emission surface of the optical emission chip array and a light sensitive surface of the optical receiver chip array. A first groove for forming a first reflective surface and a second groove for arranging a light filter that refracts light towards the optical fiber lenses array or reflects light to the receiving lenses array are provided at a top portion of the body.