Methods and systems for split voltage domain transmitter circuits may include a two-branch output stage including a plurality of CMOS transistors, with each branch of the two-branch output stage comprising two stacked CMOS inverter pairs. The two stacked CMOS inverter pairs of a given branch are configured to drive a respective load, in phase opposition to the other branch. A pre-driver circuit is configured to receive a differential modulating signal and output, to respective inputs of the two stacked CMOS inverters, two synchronous differential voltage drive signals having a swing of half the supply voltage and being DC-shifted by half of the supply voltage with respect to each other. The load may include a series of diodes that are driven in differential mode via the drive signals. An optical signal may be modulated via the diodes.

A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Methods and systems for split voltage domain receiver circuits are disclosed and may include amplifying complementary received signals in a plurality of partial voltage domains. The signals may be combined into a single differential signal in a single voltage domain. Each of the partial voltage domains may be offset by a DC voltage from the other partial voltage domains. The sum of the partial domains may be equal to a supply voltage of the integrated circuit. The complementary signals may be received from a photodiode. The amplified received signals may be amplified via stacked common source amplifiers, common emitter amplifiers, or stacked inverters. The amplified received signals may be DC coupled prior to combining. The complementary received signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked, and may be controlled via feedback loops. The photodetector may be integrated in the integrated circuit.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.

A fiber alignment or fiberposer device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.

An endoscope including an image pickup module in a distal end section, wherein the image pickup module including an image pickup unit including an image pickup device, a light emitting element configured to emit an optical signal from a light emission surface, and a ferrule disposed in the image pickup unit, in which the light emission surface is inclined at a first angle of not less than 35 degrees nor more than 55 degrees to the distal end section central axis, a fiber distal end portion is inclined at a second angle of not less than 35 degrees nor more than 55 degrees to the distal end section central axis, and the optical fiber extends toward the distal end section central axis, and is arranged along a bending section central axis in a bending section.

An endoscope includes an optical module, the optical module including an optical element including a light emitting surface, an external electrode being disposed, out of a first region and a second region obtained by dividing the light emitting surface substantially in half, only in the first region, a wiring board including a first main surface where the optical element and a bonding electrode are disposed, a bonding wire connecting the external electrode and the bonding electrode to each other, a ferrule into which the optical fiber is inserted, a frame including an upper plate where the ferrule is disposed, including a side plate fixed to the first main surface, including an inner section housing the optical element and a side surface including an opening, and a transparent resin disposed in the inner section, wherein the upper plate is inclined at a predetermined inclination angle to the first main surface.

Methods and systems for split voltage domain receiver circuits are disclosed and may include amplifying complementary received signals in a plurality of partial voltage domains. The signals may be combined into a single differential signal in a single voltage domain. Each of the partial voltage domains may be offset by a DC voltage from the other partial voltage domains. The sum of the partial domains may be equal to a supply voltage of the integrated circuit. The complementary signals may be received from a photodiode. The amplified received signals may be amplified via stacked common source amplifiers, common emitter amplifiers, or stacked inverters. The amplified received signals may be DC coupled prior to combining. The complementary received signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked, and may be controlled via feedback loops. The photodetector may be integrated in the integrated circuit.

A high-density fiber array unit includes a plurality of substrates arranged and connected in an array, a side plate arranged at one side of the plurality of substrates and connected to one of the plurality of substrates, and a plurality of fibers. Each substrate comprises a first surface and a second surface opposing the first surface, and the first surface defines positioning grooves. The side plate is connected to the first surface of one of the substrates, and each fiber can be fixed to and held by a positioning groove. A fiber array apparatus including the fiber array unit is also provided.