Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

A transparent optical device (100) is provided, comprising a lightguide medium (101) configured for light propagation, and an at least one optically functional layer (10) comprising at least one optically functional feature pattern (11) formed in a light-transmitting carrier medium (11 1) by a plurality of embedded features provided as optically functional internal cavities (12), wherein said at least one feature pattern (11) is configured to perform an incident light control function and at least a light outcoupling function, whereby stray light is minimized and optical transparency of the device (100) is established.

An optical alignment device according to an embodiment of the inventive concept includes an optical alignment plate having a first hole and at least one second hole, in which the first hole and the second hole pass through the optical alignment plate, and an optical detection element disposed on the optical alignment plate. Here, the optical detection element includes a substrate having a first surface and a second surface, which face each other, a lens disposed on the first surface, and an optical sensor disposed on the second surface, and the optical detection element vertically overlaps the first hole and the second hole. The lens is exposed to the outside by the first hole, and the second hole is connected with a vacuum suction unit to fix the optical detection element to the optical alignment plate.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.

An optical receptacle includes an optical receptacle main body and a cylindrical fixing member. The optical receptacle main body includes a first optical surface, a second optical surface, and an annular groove disposed to surround a first central axis of the first optical surface or disposed to surround a second central axis of the second optical surface. The fixing member is configured with a material with a smaller linear expansion coefficient than that of the optical receptacle main body, and is fit to the groove so as to be in contact with at least a part of an inner surface of the groove.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

The present disclosure provides an optical waveguide connection assembly and an optical module including the optical waveguide connection assembly. The optical waveguide connection assembly includes a holder, an optical fiber, a connection member and an optical coefficient adjusting member. The holder has a first part and a second part. The first part is positioned a side of the optical element, the second part is positioned above the optical element. The optical fiber is fixed to the first par. The connection member is provided between the second part and the optical element. The optical coefficient adjusting member is provided between the optical fiber and the optical element, so that a beam is capable of being transferred between the optical fiber and the optical element via the optical coefficient adjusting member. The optical waveguide connection assembly is fixed to the optical element via the connection member and the optical coefficient adjusting member.

Embodiments of the present disclosure are directed to an optical assembly for optical transceiver which is composed of two separate sub-assemblies including an assembly that is coupled with a substrate and has a post formed to have a central hollow into a multi-branched shape, for increasing the optical alignment efficiency between the optical elements included in the optical assembly for optical transceiver which involves multiple complicated and sophisticated processes, the optical assembly for optical transceiver being structured to drain out the epoxy resin or the refractive index matching material used when coupling the optical fiber inserted from the outside with the optical elements, whereby greatly reducing optical alignment errors caused by the epoxy resin or refractive index matching material, as well as directed to an optical transceiver using the optical assembly for optical transceiver.