A waveguide connecting structure includes an inserting waveguide having an inserting conduit line and a flange extending outwardly in a conduit radial-direction, and a receiving waveguide having a receiving conduit line, a receiving structure into which the inserting waveguide is inserted, and stub grooves disposed on both sides of the receiving conduit line outwardly in the direction. The receiving structure has a receiving end face extending in the radial direction and opposing to a flange end face, and an annular receiving inner-circumferential surface disposed outward of the flange and extending in a conduit axial-direction. An electric length of each stub groove in the axial direction from an opening first end to a closing second end is ½ of a conduit wavelength of the stub groove.

An opto-mechanical coupler and corresponding method of manufacture are provided. The coupler may include a body defining a bottom surface, a receiving surface, and a reflective surface. The reflective surface may redirect optical signals between a first direction and a second direction. The receiving surface may position one or more optical fibers along the second direction such that an optical signal from the plurality of optoelectronic transceivers may be directed into the one or more optical fibers or an optical signal received from the one or more optical fibers may be directed into the plurality of the optoelectronic transceivers. The receiving surface may also define grooves to locate each optical fiber at a height relative to a first optical path in the second direction.

An opto-mechanical coupler and corresponding method are provided. The coupler may include a first end and a second end configured to receive optical fibers and a top surface and bottomed surface defining a through hole extending between the top and bottom surfaces. The coupler may include a reflective surface that redirects the optical signals between a first direction and a second direction substantially perpendicular to the first direction. The coupler may position one or more optical fibers along a second direction such that an optical signal from the plurality of optoelectronic transceivers is directed into one or more optical fibers or an optical signal from the one or more optical fibers is directed into a plurality of the optoelectronic transceivers, with the coupler accommodating different diameters of optical fiber including POF, SMF, and/or MMF fiber.

A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.

An optical fiber holding structure includes: a structure main body having a prismatic shape; a through hole into which an optical fiber is inserted; a protruding portion having a columnar shape projecting from the structure main body and configured to be inserted into an opening portion of a substrate; and a contact portion configured to abut on a surface of the substrate to position an optical element and the optical fiber at a predetermined distance. The through hole is formed so as to penetrate from a surface of the structure main body through which the optical fiber is inserted to an end surface of the protruding portion, and at least one side surface of the structure main body is flush with at least one side surface of the protruding portion.

Alignment aid structures and the method of formation of these structures on an interposer comprised of a planar waveguide layer and a base structure, facilitate the alignment of the optical axes of optical and optoelectrical devices formed from and mounted to the interposer. Alignment aids formed from a common hard mask on the planar waveguide layer of the interposer structure include vertical and lateral alignment structures and fiducials. Optical losses for signals propagating in interposer-based photonic integrated circuits are reduced with effective alignment structures and methods.

Embodiments disclosed herein include an optical fiber. In an embodiment, the optical fiber comprises a core and a cladding around the core. In an embodiment, a first rod is within the cladding and adjacent to the core. In an embodiment, the first rod comprises a magnetic material. In an embodiment, the optical fiber further comprises a second rod within the cladding and adjacent to the core, where the first rod and the second rod are on opposite sides of the core.

Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In one illustrative embodiment, a PIC die has one or more waveguides and one or more vertical couplers to reflect light from the waveguides through a surface of the PIC die. An optical connector interface is positioned on the surface of the PIC die with high precision. The optical connector interface includes one or more lenses to collimate light from the one or more waveguides. An optical connector is plugged into the optical connector interface. The optical connector includes one or more lenses to focus the collimated light to one or more optical fibers. As the optical connector is coupling to collimated light, it does not need to be positioned with high precision.

An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

Apparatus and method are disclosed for co-aligning a number of laterally displaced radiation beams from respective radiation source outputs, each beam having a respective waveband. The apparatus comprises a collimating element for receiving each of said radiation beams with respective lateral displacements and a combining element for receiving each of said radiation beams passed by said collimating element. The apparatus further comprises a radiation source mount for positioning the radiation source outputs relative to the collimating element. The method comprises longitudinally positioning the radiation source outputs upon the mount, relative to the collimating element, in dependence upon the waveband of each beam, to cause the radiation beams passed by the combining element to be co-aligned.