An LED backlight driver includes at least one driving chip configured to drive a backlight module. The at least one driving chip is disposed on at least one chip-on-film package, and not in direct contact with the backlight module to reduce heat transfer to the backlight module.

Disclosed is a display device. The display device of the present disclosure may include: a display panel; a frame which is located in a rear of the display panel and to which the display panel is coupled; a substrate which is located between the display panel and the frame and coupled to the frame; and a plurality of light sources which are mounted on the substrate and spaced apart from each other, wherein the substrate may include: an elongated first plate; and a plurality of second plates which extend from the first plate in a direction intersecting with a length direction of the first plate, and are spaced apart from each other in the length direction of the first plate.

A projection display apparatus according to an embodiment of the present disclosure includes: a light source device; an image generation optical system that generates image light by modulating light from the light source device on the basis of an inputted image signal; and a projection optical system that projects the image light generated by the image generation optical system. The light source device includes a light source section, a radiation fin, a vapor chamber on which the light source section and the radiation fin are disposed, and a cooling fan. The light source section, the radiation fin, and the vapor chamber are disposed on a flow path of cooling gas sent out of the cooling fan.

An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

A pixel array may be illuminated with backlight illumination from a backlight. The backlight may include a two-dimensional array of light-emitting diodes, with each light-emitting diode being placed in a respective cell. Different light-emitting diodes may have unique brightness magnitudes based on the content of the given display frame. Driver integrated circuits may control one or more associated light-emitting diodes to have a desired brightness level. The driver integrated circuits may be formed in an active area of the backlight. The driver integrated circuits may be arranged in groups that are daisy chained together. A digital signal (that includes information such as addressing information) may be propagated through the group of driver integrated circuits. To manage thermal performance of the backlight, the backlight may include a thermally conductive layer and/or a heat sink structure. To increase the efficiency of the backlight, the backlight may include one or more reflective layers.

A backlight module. Heat sinks fill gaps between the light sources and the reflective sheet, which greatly improves the heat dissipation efficiency. Current backlight module has no space for a heat sink due to the limitation of the structure space. The invention provides a heat dissipation performance of the backlight module by optimizing to find a relatively unique position to place the heat dissipation material. The invention can effectively and quickly dissipate heat of a light emitting diode (LED) lamp to avoid problems such as reliability analysis (RA) test fluctuations.

A backlight structure, a liquid crystal display (LCD) panel and an electronic device. The backlight structure includes a backboard, a plurality of bonding units spaced apart on the backboard, a plurality of light sources fixed to the backboard by the plurality of bonding units, wherein an area of a projection of a contact surface between the light sources and the bonding units on the backplane is less than or equal to an area of a projection of the light sources on the backboard.

A backlight module. Heat sinks fill gaps between the light sources and the reflective sheet, which greatly improves the heat dissipation efficiency. Current backlight module has no space for a heat sink due to the limitation of the structure space. The invention provides a heat dissipation performance of the backlight module by optimizing to find a relatively unique position to place the heat dissipation material. The invention can effectively and quickly dissipate heat of a light emitting diode (LED) lamp to avoid problems such as reliability analysis (RA) test fluctuations.

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a backlight unit. The backlight unit may include a printed circuit board, a plurality of light-emitting diodes mounted on the printed circuit board, at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes, a partially reflective layer formed over the at least one light spreading layer, a color conversion layer formed over the partially reflective layer, a collimating layer formed over the color conversion layer, a brightness enhancement film formed over the collimating layer, and a diffuser formed over the brightness enhancement film. The at least one light spreading layer may include two light spreading layers with elongated protrusions that are rotated relative to each other.

A liquid crystal display apparatus includes a liquid crystal display panel and a backlight device disposed on a rear face of the liquid crystal display panel. The backlight device includes a chassis, a plurality of LED units being disposed on the chassis and arranged in at least one direction, and a cooling structure thermally coupled to rear faces of the plurality of LED units. The cooling structure includes a plurality of enclosed spaces, each of the plurality of enclosed spaces containing a coolant in which a liquid phase and a gas phase coexist at room temperature. Each of the plurality of enclosed spaces is disposed correspondingly to at least one LED unit among the plurality of LED units arranged in the at least one direction.