A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface at a first height above the top substrate surface exceeding 0.4 millimeters and an aperture spanning the top sidewall surface and the top substrate surface. The conductor at least partially fills the aperture for electrically connecting to the conductive layer. A method for mechanically and electrically connecting a LCoS panel to a panel carrier having a short sidewall includes electrically connecting a transparent conductive layer of the LCoS panel to a conductive material, within the short sidewall, with a conductive adhesive having a thickness, between the transparent conductive layer and the short sidewall, less than two-hundred micrometers.

An example embodiment includes a liquid crystal on silicon (LCOS) system. The LCOS system includes multiple pixels, a pixel voltage supply source (voltage source), an external buffer, and a local buffer. The voltage source is configured to supply an analog ramp to the pixels. The external buffer is configured to buffer the voltage source from the pixels. The local buffer is configured to buffer the external buffer from a subset of pixels of the plurality of pixels.

In various embodiments, a light-emitting diode arrangement is provided. The light-emitting diode arrangement includes a first substrate with a first light-emitting diode which is arranged on the first substrate such that light emitted by it radiates in a main emission direction of the light-emitting diode arrangement, and a second substrate with a second light-emitting diode which is arranged on the second substrate such that light emitted by it radiates in the main emission direction of the light-emitting diode arrangement. The second substrate is arranged above the first substrate, such that the second substrate at least partly covers the first substrate.

An example embodiment includes a liquid crystal on silicon (LCOS) system. The LCOS system includes multiple pixels, a pixel voltage supply source (voltage source), an external buffer, and a local buffer. The voltage source is configured to supply an analog ramp to the pixels. The external buffer is configured to buffer the voltage source from the pixels. The local buffer is configured to buffer the external buffer from a subset of pixels of the plurality of pixels.

An optical device includes a first fiber; a liquid crystal member configured to have liquid crystal pixels that reflect light output from the first fiber; a second fiber configured to have a core to which a first order light ray in the light reflected by the liquid crystal member is optically connected; a light receiving circuit configured to receive higher order light rays in the light reflected by the liquid crystal member; and a control circuit configured to control based on a light receiving result of the light receiving circuit, efficiency of optical connection of the first order light ray to the core of the second fiber, by varying an angle of the light reflected by the liquid crystal member.

According to one embodiment, a projection type liquid crystal display device includes a liquid crystal display panel and a bezel. The liquid crystal display panel includes an array substrate, an opposed substrate, and a liquid crystal layer provided between the array substrate and the opposed substrate. The liquid crystal display panel has a first surface on one side of the array substrate and the opposed substrate, and a second surface on another side of the array substrate and the opposed substrate. The bezel covers a part of the liquid crystal panel. The bezel includes a first opening provided on a side of the first surface and a second opening provided on a side of the second surface. The second opening has a larger size than the first opening.

A system includes a frame, an ultraviolet light source, an LCD panel, and a computer. The frame is configured to retain a substrate to be converted into a silk screen stencil. The LCD panel is positioned between the frame and the ultraviolet light source. The computer is coupled to the LCD panel. The computer is configured to transfer image data to the LCD panel. The image data defines an image to be transferred to the substrate.

A driving substrate is provided. The driving substrate includes a substrate and a thin film transistor disposed on the substrate. The thin film transistor includes a first metal layer, a second metal layer, and a semiconductor. The first metal layer has a first portion, a second portion, and a first bridge. The second metal layer has a third portion, a fourth portion, and a second bridge. The first metal layer is overlapped with the second metal layer and the semiconductor. In a top view, the first portion and the second portion are separated by a first gap and are connected by the first bridge, the third portion and the fourth portion are separated by the first gap and are connected by the second bridge.

A display may include illumination optics, a ferroelectric liquid crystal on silicon (fLCOS) panel, and a waveguide. The illumination optics may produce linear polarized illumination light that is modulated by the fLCOS panel to produce image light. The illumination optics may include light emitters that emit respective wavelengths of the illumination light. The illumination optics may include an X-plate that outputs the illumination light by combining the light emitted by the light emitters. Polarization recycling structures may be optically interposed between each of the light emitters and the X-plate. The polarization recycling structures may include a reflective polarizer. If desired, the polarizing recycling structures may also include a quarter waveplate. The polarization recycling structures may serve to minimize the amount of light lost in producing linearly polarized illumination light for the fLCOS display panel, thereby maximizing the optical efficiency of the display.

A driving substrate is provided. The driving substrate includes a substrate and a first metal layer disposed thereon. The first metal layer has a first portion, a second portion, and a third portion, in a top view, the first portion and the second portion are arranged along a first direction, and the third portion extends along the first direction and is connected between the first portion and the second portion. In a second direction perpendicular to the first direction, a width of the third portion is less than both a width of the first portion and a width of the second portion. The driving substrate includes a second metal layer disposed on the substrate and overlapped with the first portion and the second portion; and a semiconductor disposed on the substrate. The first metal layer, the second metal layer, and the semiconductor are overlapped with each other.