An RFIC module is provided that includes an RFIC, an antenna connection first electrode, an antenna connection second electrode, an RFIC connection first electrode, an RFIC connection second electrode, an impedance matching circuit that matches impedance between the RFIC and an antenna, and a substrate. The impedance matching circuit includes a first coil and a second coil that each have a coil opening extending along a surface of the substrate. The first coil and the second coil are juxtaposed on the substrate with the antenna connection first electrode and the antenna connection second electrode interposed therebetween.

A method of using shielded straps with RFID tag designs is disclosed. Specifically, the RFID device, in one embodiment, comprises a bridge conductor which couples the antenna and pair of strap pads together. Thus, the coupling between the bridge conductor and the strap conductor, the coupling between the bridge conductor and the antenna conductor, and the coupling between the antenna conductor and the strap conductor increases the total capacitance of the RFID strap device. Further, the presence of the bridge conductor also reduces the area occupied for a given inductance, and provides a higher effective capacitance when the bridge strap is connected to the antenna.

A radio frequency integrated circuit (RFIC) includes a transmitting circuit configured to provide a first signal for transmission by an antenna in a transmitting mode, the transmitting circuit including a coil configured to be coupled to the antenna and at least one mode setting circuit configured to activate a resonant circuit including at least a portion of the coil in a receiving mode. The RFIC further includes a receiving circuit configured to receive a second signal received from the antenna in the receiving mode. Related wireless communication devices and communication circuits are provided.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). An electronic device and an operation method thereof are provided for testing performance of a radio frequency integrated circuit (RFIC) in a wireless communication system. The method includes checking a connection state of elements operable as combiners and a plurality of RF chains of the RFIC; performing control to output RF signals from the plurality of RF chains; acquiring an integrated signal by combining the RF signals via the combiners; and determining a quality indicator for the RFIC based the integrated signal.

An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at least one re-passivation layer. The at least one electrical contact is deposited on at least one first portion and the at least one re-passivation layer is deposited on at least one second portion, which is distinct of the at least one first portion.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

The invention relates to a method for producing a chip card module. According to this method, the following are produced: a module with a substrate having contacts and an electronic chip connected to at least some contacts; an antenna on a carrier, this antenna including two ends, each equipped with a connection land; a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna; a first end of a wire is connected directly to a connection pad of the chip, and another portion is connected directly to a connection land of the antenna, after having inserted the module into the cavity.