A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

A Smart Patch comprising a label layer, an adhesive layer, a release liner layer and a RFID inlay, wherein the release liner comprises a separable inner release liner portion and a separable outer release liner portion; and the RFID inlay is adhered to a back surface of the inner release liner portion. The Smart Patches for uses including mounting to tires and other rubber materials. Methods of manufacturing including subjecting a release liner of the label to a die cut slightly larger than the size of an intended RFID inlay to form the separable inner release liner portion and outer release liner portion and applying a RFID inlay to a back surface of a release liner within the die cut inner release liner portion.

A portable dual-interface data carrier contains a metal sheet which can be provided with low technical effort and especially no ferrite material is required. The resulting portable dual-interface data carrier is more heavy than a state of the art PVC smart card and provides contact based interface on one side, whereas contactless interfaces is working from both sides of the card. One application domain of the data carrier is to provide a so-called smartcard. The present invention is furthermore directed towards a dual-interface module as well as towards a method for providing a portable dual-interface data carrier. Moreover, a data carrier is suggested comprising instructions for performing the suggested method and for manufacturing the portable dual-interface data carrier.

The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.

The invention relates to a chip card manufacturing method. According to this method, there are produced on the one hand, a module including a substrate supporting contacts on one face, and bonding pads on the other, on the other hand, an antenna on a support. The ends of the antenna are linked to lands of connection lands receiving a drop of soldering material on a connection portion. In order to make the soldered electrical connection between the module and the antenna reliable, the bonding pads extend over a zone covering a surface area less than that of the connection portions. The invention relates also to a chip card whose module includes bonding pads extending over a zone covering a surface area less than that of the connection portions.

Embodiments are directed to assembling an RFID tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.

Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.

A near-field communication tag includes a logic section that responds to a radio-frequency identification interrogation signal. An elongated, printed, interconnect has a first end coupled to the integrated circuit. An antenna is on a second end of the interconnect. The antenna is electrically coupled to the conductive lines of the interconnect and operable to send and receive wireless signals of the radio-frequency identification interrogation and communicate the wireless signals with the integrated circuit via the interconnect.

A wireless IC device includes a resin member including first and second surfaces, a substrate including first and second principal surfaces, a coil antenna provided in the resin member, and an RFIC element mounted on the substrate and connected to the coil antenna. The substrate is embedded in the resin member so that the second principal surface is at a second surface side. The coil antenna is defined by first linear conductor patterns on the second surface, first metal posts extending between the first and second surfaces, second metal posts extending between the first and second surfaces, and second linear conductor patterns on the first surface. The RFIC element is disposed in the coil antenna.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.