A device has a substrate, a plurality of switches located on the substrate, a plurality of NFC chips, each associated with a switch, and an NFC antenna. The switches and the NFC chips associated therewith are interconnected in series and are connected to the NFC antenna. The device contains a label which is joined face to face with the substrate, the individual NFC chips are arranged on the label. The switches are arranged on the substrate but not on the label, and mutually opposed contact points contacting the conductor tracks with each other are provided on the substrate and on the label to electrically connect the switches, the NFC chips and the NFC antenna.

The present invention provides an RFID tag to be applied to a container for holding liquid. To achieve a good communication distance regardless of the presence or absence of liquid, the RFID is applied to a container for holding liquid, and includes an IC chip on which identification information is recorded, and an antenna made of a loop-shaped conductor connected to the IC chip, and the antenna has a T-shaped opening in which the conductor is not formed.

A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

An RFID tag includes a circuit board, an RFID IC and a functional module. The circuit board has an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is connected to the circuit board through a lead wire. An electrical length of a connection wiring that electrically connects the functional module to an element on the circuit board is within 10% of an integral multiple of a half wavelength of a radio signal that the RFID IC transmits or receives.

A dual interface transaction card for contact and contactless transactions including an anodized top metal layer. The arrangement of layers allowing for high conductivity metals such as aluminum to be used without compromising the contactless function of the card.

A switchable radio-frequency identification (RFID) tag device comprising: a first RFID module positioned on a first plane; at least one un-tuned antenna section positioned on a second plane, wherein the first plane is positioned parallel to the second plane; a second RFID module positioned on the first plane; a third RFID module positioned on the first plane; and a sliding mechanism configured to move between a first position, a second position, and a third position; and wherein, in the first position, the first RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the second and third RFID modules are detuned and/or inoperable; and in the second position, the second RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the first RFID module and third RFID module are detuned and/or inoperable; and in the third position, the third RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the first and second RFID modules are detuned and/or inoperable.

An RFID tag includes a sheet-like substrate, an IC chip disposed on a first face of the substrate, a conductive adhesive that is positioned around the IC chip along the first face and fixes the IC chip to the substrate, an antenna pattern formed on a second face, of the substrate, that is opposite to the first face, and a through hole that penetrates the substrate toward the conductive adhesive around the IC chip and electrically connects the antenna pattern with the IC chip.

Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.

The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.

The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).