The present disclosure is directed to a contactless card including an actuation security structure that is actuated to provide authorization in accessing identifying information on an integrated circuit within the contactless card. In at least one embodiment, the actuation security structure includes a pair of conductive layers and a pair of electrodes. Ends of the pair of conductive layers overlap respective ones of the pair of electrodes. The ends of the pair of conductive layers are at and in a first elastically deformable region and the respective ones of the pair of electrodes are at and in a second elastically deformable region. An owner of the contactless card may provide authorization to access the identification information on the contactless card by applying force to both the first and second elastically deformable regions inward resulting in the ends of the conductive layers moving into electrical communication with the pair of electrodes.

A dual interface transaction card for contact and contactless transactions includes a top metal layer having an upper surface and a bottom surface. The transaction card may also include a magnetic platform, and the magnetic platform may include a magnetic layer and a thermoplastic perimeter layer. The magnetic layer includes an upper surface, a bottom surface, and a periphery extending between the bottom surface and the upper surface of the magnetic layer. The thermoplastic perimeter layer surrounds the periphery of the magnetic layer. The transaction card also includes an antenna package layer.

Various embodiments of RFID switch devices are disclosed herein. Such RFID switch devices advantageously enable manual activation/deactivation of the RF module. The RFID switch device may include a RF module with an integrated circuit adapted to ohmically connect to a substantially coplanar conductive trace pattern, as well as booster antenna for extending the operational range of the RFID device. The operational range of the RFID switch device may be extended when a region of the booster antenna overlaps a region of the conductive trace pattern on the RF module via inductive or capacitive coupling. The RFID switch device may further include a visual indicator displaying a first color if the RFID switch device is in an active state and/or a second color if the RFID switch device is in an inactive state.

An RFIC device including a resin block having a first surface, a second surface that faces the first surface, and a through-hole that extends through the first surface and the second surface. Moreover, the RFIC device includes an RFIC element that is embedded in the resin block and a coil antenna disposed in the resin block that is connected with the RFIC element and that has a central axis that extends from the first surface to the second surface. In addition, the through-hole extends inside the coil antenna.

The disclosure relates to a dual-interface integrated circuit (IC) card. Embodiments disclosed include a dual-interface card (100) comprising: a card body (122) containing an antenna (120), the antenna having first and second antenna connections; and a dual-interface integrated circuit card module (150) comprising: a substrate (104) having first and second opposing surfaces; a contact area (102) on the first surface of the substrate (104), the contact area (102) comprising a plurality of contact pads (108) and first and second routing connections (106) each having a first end and a second end; an integrated circuit (110) on the second surface of the substrate (104); electrical connections through the substrate (104) connecting the integrated circuit (110) to the plurality of contact pads (108) and to the first end of each of the first and second routing connections (106); and first and second antenna connectors (118) disposed in respective first and second holes (103) in the substrate (104) and in electrical contact with the second end of the respective first and second routing connections, wherein the first and second antenna connectors (118) of the card module are electrically connected to the first and second antenna connections of the card body (122).

Embodiments are directed to assembling an RFID tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.

An implantable electronic tag (100) for a tire and an assembly process. The electronic tag (100) mainly comprises: an antenna (102); a radio frequency chip module (101); and a connection terminal (103). The radio frequency chip module (101) has an electrode (101b) provided thereon. The connection terminal (103) has one end connected to the antenna (102) and another end in cold-press connection with the electrode (101b) of the radio frequency chip module (101). Upon assembly, a radio frequency chip is encapsulated to form the radio frequency chip module (101). The connection terminal (103) is initially riveted to the antenna (102) and then connected to the electrode (101b) of the encapsulated body by means of cold-pressing. The radio frequency chip module (101) connected to the antenna (102) is encapsulated. The implantable electronic tag (100) for a tire is an ultra-high frequency, readable and writable radio frequency tag. The electronic tag is compliant with HG/T 4953-4956-2016 standards for tire radio frequency identification (RFID) tag mechanical implantation methods, performance test methods and coding.

A Radio Frequency Identification (RFID) integrated circuit (IC) is at least partially covered by a repassivation layer that is, in turn, at least partially covered by a large, electrically conductive contact pad. The repassivation layer is disposed so as to leave uncovered at least one IC contact. The large contact pad is disposed so as to cover the IC IC contact. The large contact pad forms a first galvanic coupling to the IC contact and a second galvanic coupling to a tag antenna. The surface area of the first galvanic coupling is substantially smaller than the surface area of the second galvanic coupling.

A method produces non-contact dielectric bridges using a transfer machine for positioning an integrated circuit on a conductive circuit and a laser for ensuring the connection of the contacts thereof. The contacts of the integrated circuit that have been registered by a transfer machine in relation to the contacts of the conductive circuit, arranged on a continuous support made of heat- and radiation-resistant polyimide and held under pressure by the device, are welded together using a laser beam. The laser is positioned beneath the continuous support and built into the transfer machine. When the laser is used, the continuous support is immobilized by a stop and go device. The method is designed to increase the productivity of systems used to produce RFID tags, as a result of low investment costs and much faster speeds of connection of the contacts of the integrated circuit and the conductive circuit. The method allows the use of non-contact identification tags to become widespread over many professions.

Disclosed is an antenna support for incorporating in an electronic document. The support can include a first substrate made of a plastics material that is defined by first and second opposite faces, which define between them a thickness of the substrate. The antenna can include one or more turn that extends between two ends, and the antenna can be formed by a wire that is inlaid in the thickness of the first substrate from the first face, such that each of the two ends presents a zigzag shape formed by at least two rectilinear portions and by two bends. The bends can be inlaid more deeply than the rectilinear portions in the thickness of the first substrate from the first face.